MOCD223M Fairchild Semiconductor, MOCD223M Datasheet

Transistor Output Optocouplers SO-8 DUAL CH PHOTO

MOCD223M

Manufacturer Part Number
MOCD223M
Description
Transistor Output Optocouplers SO-8 DUAL CH PHOTO
Manufacturer
Fairchild Semiconductor
Datasheet

Specifications of MOCD223M

Maximum Input Diode Current
60 mA
Maximum Reverse Diode Voltage
6 V
Output Device
Darlington
Output Type
DC
Configuration
2
Input Type
DC
Maximum Collector Emitter Voltage
30 V
Maximum Collector Emitter Saturation Voltage
1000 mV
Isolation Voltage
2500 Vrms
Current Transfer Ratio
1000 % (Typ)
Maximum Forward Diode Voltage
1.3 V
Maximum Collector Current
150 mA
Maximum Power Dissipation
250 mW
Maximum Operating Temperature
+ 100 C
Minimum Operating Temperature
- 40 C
Package / Case
SOIC-8 Narrow
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MOCD223M_NL

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MOCD223M
Manufacturer:
FAIRCHILD/仙童
Quantity:
20 000
©2003 Fairchild Semiconductor Corporation
MOCD223M Rev. 1.0.1
MOCD223M
Dual Channel Phototransistor Small Outline Surface
Mount Optocouplers
Features
Applications
Schematic
LED 1 CATHODE
LED 2 CATHODE
U.L. Recognized (File #E90700, Volume 2)
VDE Recognized (File #13616) (add option “V” for
VDE approval, i.e, MOCD223VM)
Convenient Plastic SOIC-8 Surface Mountable
Package Style
High Current Transfer Ratio of 500% Minimum at
I
Minimum BV
Standard SOIC-8 Footprint, with 0.050" Lead Spacing
Compatible with Dual Wave, Vapor Phase and IR
Reflow Soldering
High Input-Output Isolation Voltage of 2500 V
Guaranteed
Interfacing and coupling systems of different
potentials and impedances
General purpose switching circuits
Monitor and detection circuits
LED 1 ANODE
F
LED 2 ANODE
= 1mA
CEO
1
2
3
4
of 30 Volts Guaranteed
8
7
6
5
COLLECTOR 1
EMITTER 1
COLLECTOR 2
EMITTER 2
AC(rms)
Description
The MOCD223M consist of two gallium arsenide infrared
emitting diodes optically coupled to two monolithic silicon
phototransistor darlington detectors, in a surface mount-
able, small outline plastic package. It is ideally suited for
high density applications that require low input current
and eliminates the need for through-the-board mounting.
Package Outline
www.fairchildsemi.com
April 2009

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MOCD223M Summary of contents

Page 1

... Fairchild Semiconductor Corporation MOCD223M Rev. 1.0.1 Description The MOCD223M consist of two gallium arsenide infrared emitting diodes optically coupled to two monolithic silicon phototransistor darlington detectors surface mount- able, small outline plastic package ideally suited for high density applications that require low input current and eliminates the need for through-the-board mounting ...

Page 2

... Total Device Power Dissipation @ T D Derate above 25°C T Ambient Operating Temperature Range A T Storage Temperature Range stg T Lead Soldering Temperature L (1/16" from case, 10 sec. duration) ©2003 Fairchild Semiconductor Corporation MOCD223M Rev. 1.0 25°C Unless otherwise specified) A Rating = 25° 25°C A (1,2,3) = 25° Value ...

Page 3

... For this test, Pins and 4 are common and Pins and 8 are common rating of 2500 V for min. is equivalent to a rating of 3,000 V ISO AC(rms) 4. Current Transfer Ratio (CTR ©2003 Fairchild Semiconductor Corporation MOCD223M Rev. 1.0 25°C unless otherwise specified) A Test Conditions I = 1.0mA ...

Page 4

... A 1 – LED FORWARD CURRENT (mA) F Fig. 3 Output Current vs. Ambient Temperature 10 1 0.1 0.01 -80 -60 -40 - – AMBIENT TEMPERATURE ( A ©2003 Fairchild Semiconductor Corporation MOCD223M Rev. 1.0 100 V NORMALIZED TO I 0.1 0.1 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0 1mA 0.2 ...

Page 5

... TEST CIRCUIT I F INPUT R BE Figure 6. Switching Time Test Circuit and Waveform ©2003 Fairchild Semiconductor Corporation MOCD223M Rev. 1.0 10V 10% OUTPUT 90 WAVE FORMS INPUT PULSE OUTPUT PULSE off www.fairchildsemi.com ...

Page 6

... Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/ ©2003 Fairchild Semiconductor Corporation MOCD223M Rev. 1.0.1 8 0.164 (4.16) 0.144 (3.66) 1 ...

Page 7

... Ordering Information Option Order Entry Identifi R2V Marking Information Definitions ©2003 Fairchild Semiconductor Corporation MOCD223M Rev. 1.0.1 V VDE 0884 R2 Tape and reel (2500 units per reel) R2V VDE 0884, Tape and reel (2500 units per reel) 1 D223 Fairchild logo Device number VDE mark (Note: Only appears on parts ordered with VDE option – ...

Page 8

... Carrier Tape Specifications 3.50 0.20 0.30 MAX 8.3 0.10 0.1 MAX User Direction of Feed Dimensions in mm ©2003 Fairchild Semiconductor Corporation MOCD223M Rev. 1.0.1 8.0 0.10 2.0 0.05 4.0 0.10 6.40 0.20 8 Ø1.5 MIN 1.75 0.10 5.5 0.05 12.0 0.3 5.20 0.20 Ø ...

Page 9

... Time (t ) Maintained Above (T L Peak Body Package Temperature Time (t ) within 5°C of 260°C P Ramp-down Rate (T Time 25°C to Peak Temperature ©2003 Fairchild Semiconductor Corporation MOCD223M Rev. 1.0.1 Max. Ramp-up Rate = 3°C/S Max. Ramp-down Rate = 6°C/S Tsmax Preheat Area Tsmin t s 120 240 Time 25° ...

Page 10

... Datasheet Identification Product Status Advance Information Formative / In Design First Production Preliminary No Identification Needed Full Production Obsolete Not In Production ©2003 Fairchild Semiconductor Corporation MOCD223M Rev. 1.0.1 ® PowerTrench ® PowerXS™ SM Programmable Active Droop™ ® QFET QS™ Quiet Series™ RapidConfigure™ ...

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