AH31-G TriQuint, AH31-G Datasheet - Page 7

• Manufacturer Part Number: AH31-G
• Description: RF Amplifier 50-1000MHz 19dB Gain
• Manufacturer: TriQuint
• Type: General Purpose Amplifierr

Specifications of AH31-G

• Mounting Style: SMD/SMT
• Number Of Channels: 1
• Operating Frequency: 1000 MHz
• Noise Figure: 1.9 dB
• Operating Supply Voltage: 5 V
• Supply Current: 180 mA @ 5 V
• Maximum Operating Temperature: + 160 C
• Minimum Operating Temperature: - 40 C
• Package / Case: SOT-89
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 1066870

WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: [phone] • e-mail: [e-mail] • Web site: www.wj.com, www.TriQuint.com
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 °C reflow temperature) and leaded
AH31-G (Green / Lead-free SOT-89 Package) Mechanical Information
AH31
High Dynamic Range IF Amplifier
AH31G
XXXX-X
(maximum 245 °C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Land Pattern
Specifications and information are subject to change without notice
The AH31-G will be marked with an
“AH31G” designator. An alphanumeric lot
code (“XXXX-X”) is also marked below the
part designator on the top surface of the
package.
marked with an “AH31” designator followed
by an alphanumeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD Rating: Class 1B
Value:
Test:
Standard:
ESD Rating: Class IV
Value:
Test:
Standard:
MSL Rating: Level 3 at +260 °C convection reflow
Standard:
1. Ground / thermal vias are critical for the proper
2. Add as much copper as possible to inner and outer
3. Mounting screws can be added near the part to fasten
4. Do not put solder mask on the backside of the PC board
5. RF trace width depends upon the PC board material
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
Mounting Config. Notes
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated
thru diameter of .25 mm (.010”).
layers near the part to ensure optimal thermal
performance.
the board to a heatsink.
thermal via region contacts the heatsink.
in the region where the board contacts the heatsink.
and construction.
in degrees.
MSL / ESD Rating
Product Marking
The obsolete tin-lead package is
Passes
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Passes
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
JEDEC Standard J-STD-020
500V to <1000V
1000V to <2000V
Ensure that the ground /
Page 7 of 7 January 2008