AG604-86G TriQuint, AG604-86G Datasheet - Page 5

• Manufacturer Part Number: AG604-86G
• Description: RF Amplifier DC-6000MHz 20.5dB Gain@900MHz
• Manufacturer: TriQuint
• Type: Buffer Amplifierr

Specifications of AG604-86G

• Mounting Style: SMD/SMT
• Number Of Channels: 1
• Operating Frequency: 6000 MHz
• P1db: 19.5 dBm at 900 MHz
• Noise Figure: 3.5 dB @ 900 MHz
• Operating Supply Voltage: 5.16 V
• Supply Current: 75 mA (Typ) @ 6 V
• Maximum Operating Temperature: + 177 C
• Package / Case: SOT-86
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 1066848

WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: [phone] • e-mail: [e-mail] • Web site: www.wj.com, www.TriQuint.com
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 °C reflow temperature) and leaded
AG604-86G (Green / Lead-free Sot-86 Package) Mechanical Information
(maximum 245 °C reflow temperature) soldering processes. The plating material on the pins is annealed matte tin over copper.
AG604-86
InGaP HBT Gain Block
Outline Drawing
Land Pattern
Specifications and information are subject to change without notice
The component will be marked with an “V”
designator followed by a two-digit numeric lot
code on the top surface of the package.
obsolete tin-lead package is marked with a “K”
designator followed by a two-digit numeric lot
code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD Rating: Class 1C
Value:
Test:
Standard:
ESD Rating: Class IV
Value:
Test:
Standard:
MSL Rating: Level 3 at +260 °C convection reflow
Standard:
1. Ground / thermal vias are critical for the proper
2. Add as much copper as possible to inner and outer layers
3. Mounting screws can be added near the part to fasten the
4. Do not put solder mask on the backside of the PC board in
5. RF trace width depends upon the PC board material and
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
Mounting Config. Notes
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated thru
diameter of .25 mm (.010”).
near the part to ensure optimal thermal performance.
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
the region where the board contacts the heatsink.
construction.
degrees.
Product Marking
MSL / ESD Rating
Passes ≥ 1000V min.
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Passes ≥ 1000V min.
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
JEDEC Standard J-STD-020
Page 5 of 5 March 2008
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