ES2G Taiwan Semiconductor, ES2G Datasheet
ES2G
Manufacturer Part Number
ES2G
Description
Rectifiers 2A 400V
Manufacturer
Taiwan Semiconductor
Datasheet
1.ES2D.pdf
(2 pages)
Specifications of ES2G
Product
Fast Recovery Rectifier
Configuration
Single
Reverse Voltage
400 V
Forward Voltage Drop
1.3 V
Recovery Time
35 ns
Forward Continuous Current
2 A
Max Surge Current
50 A
Reverse Current Ir
10 uA
Mounting Style
SMD/SMT
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 55 C
Package / Case
SMB
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
R4
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
ES2G
Manufacturer:
VISHAY
Quantity:
50 000
Part Number:
ES2G
Manufacturer:
VISHAY/威世
Quantity:
20 000
Company:
Part Number:
ES2G (SMB)
Manufacturer:
DEC
Quantity:
2 642
Company:
Part Number:
ES2G-13-F
Manufacturer:
DIODES
Quantity:
15 000
Part Number:
ES2G-13-F
Manufacturer:
DIODES/美台
Quantity:
20 000
Part Number:
ES2G-AU
Manufacturer:
PANJIT/强茂
Quantity:
20 000
Company:
Part Number:
ES2G-E3/52T
Manufacturer:
VISHAY
Quantity:
25 000
Part Number:
ES2G-E3/52T
Manufacturer:
VISHAY/威世
Quantity:
20 000
Part Number:
ES2G-E3/52T(EG)
Manufacturer:
JXND/VISHAYMAS
Quantity:
20 000
Features
Mechanical Data
Maximum Ratings and Electrical Characteristics
Rating at 25
Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
Maximum Recurrent Peak Reverse
Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Average Forward Rectified
Current See Fig. 1
Peak Forward Surge Current, 8.3 ms
Single Half Sine-wave Superimposed on
Rated Load (JEDEC method )
Maximum Instantaneous Forward Voltage
@ 2.0A
Maximum DC Reverse Current
@T
@ T
Maximum Reverse Recovery Time
( Note 1 )
Typical Junction Capacitance ( Note 2 )
Maximum Thermal Resistance (Note 3)
Operating Temperature Range
Storage Temperature Range
Notes:
Type Number
A
A
=25
=100
Laboratory Classification 94V-0
Glass passivated junction chip
For surface mounted application
Low profile package
Built-in strain relief
Ideal for automated placement
Easy pick and place
Superfast recovery time for high efficiency
Glass passivated chip junction
High temperature soldering:
Plastic material used carries Underwriters
Cases: Molded plastic
Terminals: Pure tin plated, lead free.
Polarity: Indicated by cathode band
Packing: 12mm tape per EIA STD RS-481
Weight: 0.093 gram
260
o
C at Rated DC Blocking Voltage
O
o
C
C/10 seconds at terminals
1. Reverse Recovery Test Conditions: I =0.5A, I =1.0A, I
2. Measured at 1 MHz and Applied V =4.0 Volts
3. Units Mounted on P.C.B. 0.4” x 0.4” (10mm x 10mm) Pad Areas
O
C
ambient temperature unless otherwise specified.
Symbol
2.0 AMPS. Surface Mount Super Fast Rectifiers
V
V
R
I
R
V
I
T
FSM
(AV)
Trr
RRM
V
RMS
Cj
I
T
STG
DC
R
F
J
ES
2A
50
35
50
100
100
ES
2B
70
0.95
25
Dimensions in inches and (millimeters)
150
105
150
ES
2C
.103(2.61)
.078(1.99)
=0.25A
.083(2.10)
.077(1.95)
.056(1.41)
.035(0.90)
-55 to +150
-55 to +150
200
140
200
ES
2D
SMB/DO-214AA
350
2.0
50
10
35
75
20
300
210
300
ES
2F
1.3
.209(5.30)
.201(5.10)
.187(4.75)
.167(4.25)
ES2A - ES2J
400
280
400
ES
2G
20
.008(.20)
.004(.10)
500
350
500
ES
2H
.012(.31)
.006(.15)
1.7
.147(3.73)
.137(3.48)
600
420
600
.012(.31)
.006(.15)
ES
2J
Version: A06
o
Units
C /W
uA
uA
nS
pF
V
V
V
A
A
V
C
C
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ES2G Summary of contents
Page 1
Features Glass passivated junction chip For surface mounted application Low profile package Built-in strain relief Ideal for automated placement Easy pick and place Superfast recovery time for high efficiency Glass passivated chip junction High temperature soldering: O 260 C/10 seconds ...
Page 2
RATINGS AND CHARACTERISTIC CURVES (ES2A THRU ES2J) FIG.1- MAXIMUM FORWARD CURRENT DERATING CURVE 3.0 RESISTIVE OR INDUCTIVE LOAD 0.4X0.4"(10X10mm) COPPER PAD AREAS 2.0 1 100 110 120 o LEAD TEMPERATURE FIG.3- MAXIMUM NON-REPETITIVE PEAK FORWARD ...