S29GL032N90TFI030 Spansion Inc., S29GL032N90TFI030 Datasheet - Page 76

Flash 3V 32Mb Float Gate two address 90s

S29GL032N90TFI030

Manufacturer Part Number
S29GL032N90TFI030
Description
Flash 3V 32Mb Float Gate two address 90s
Manufacturer
Spansion Inc.
Datasheet

Specifications of S29GL032N90TFI030

Memory Type
NOR
Memory Size
32 Mbit
Access Time
90 ns
Data Bus Width
8 bit, 16 bit
Architecture
Uniform / Boot Sector
Interface Type
Page-mode
Supply Voltage (max)
3.6 V
Supply Voltage (min)
2.7 V
Maximum Operating Current
50 mA
Mounting Style
SMD/SMT
Operating Temperature
+ 85 C
Package / Case
TSOP-48
Ic Interface Type
CFI, Parallel
Supply Voltage Range
2.7V To 3.6V
Memory Case Style
TSOP
No. Of Pins
48
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

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17.3
76
CORNER
PACKAGE
JEDEC
SYMBOL
A
SD / SE
PIN A1
MD
ME
A1
A2
D1
E1
φb
A
D
E
N
e
A1
VBK048—Ball Fine-pitch Ball Grid Array (BGA) 8.15x 6.15 mm Package
0.18
0.62
0.35
MIN
8.15 mm x 6.15 mm NOM
---
INDEX MARK
10
PACKAGE
8.15 BSC.
6.15 BSC.
5.60 BSC.
4.00 BSC.
0.80 BSC.
0.40 BSC.
VBK 048
NOM
N/A
48
---
---
---
---
---
8
6
SEATING PLANE
TOP VIEW
SIDE VIEW
MAX
1.00
0.76
0.43
---
D
OVERALL THICKNESS
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
BALL FOOTPRINT
BALL FOOTPRINT
ROW MATRIX SIZE D DIRECTION
ROW MATRIX SIZE E DIRECTION
TOTAL BALL COUNT
BALL DIAMETER
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
S29GL-N MirrorBit
NOTE
A
0.10
A2
C
(4X)
E
B
D a t a
®
Flash Family
e
0.08
0.10
NOTES:
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
4.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
6
7
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
C
6
C
S h e e t
AS NOTED).
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
BALLS.
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
φb
φ 0.08
φ 0.15
H
M
M
C
C
G
A
BOTTOM VIEW
B
F
E
D1
D
S29GL-N_01_12 October 29, 2008
SD
C
7
B
A
6
5
4
3
2
1
3338 \ 16-038.25 \ 10.05.04
A1 CORNER
SE
7
E1

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