S29GL256P11TFI010 Spansion Inc., S29GL256P11TFI010 Datasheet - Page 9

Flash 3V 256Mb Mirrorbit highest address110ns

S29GL256P11TFI010

Manufacturer Part Number
S29GL256P11TFI010
Description
Flash 3V 256Mb Mirrorbit highest address110ns
Manufacturer
Spansion Inc.

Specifications of S29GL256P11TFI010

Memory Type
NOR
Memory Size
256 Mbit
Access Time
110 ns
Data Bus Width
8 bit, 16 bit
Architecture
Uniform
Interface Type
Page-mode
Supply Voltage (max)
3.6 V
Supply Voltage (min)
2.7 V
Maximum Operating Current
50 mA
Mounting Style
SMD/SMT
Operating Temperature
+ 85 C
Package / Case
TSOP-56
Memory Configuration
128K X 16
Ic Interface Type
Parallel
Supply Voltage Range
2.7V To 3.6V
Memory Case Style
TSOP
No. Of Pins
56
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
S29GL256P11TFI010
Quantity:
5 530
Part Number:
S29GL256P11TFI010
Manufacturer:
SPANSION
Quantity:
5 530
Part Number:
S29GL256P11TFI010
Manufacturer:
SPANSION
Quantity:
72
3. Block Diagram
4. Physical Dimensions/Connection Diagrams
4.1
4.2
November 21, 2006 S29GL-P_00_A3
** A
A
Max
WP#/ACC
Max
RESET#
**–A0
BYTE#
GL01GP=A25, A
WE#
OE#
V
CE#
V
V
CC
SS
IO
Related Documents
Special Handling Instructions for BGA Package
This section shows the I/O designations and package specifications for the S29GL-P.
The following documents contain information relating to the S29GL-P devices. Click on the title or go to
www.spansion.com download the PDF file, or request a copy from your sales office.
Special handling is required for Flash Memory products in BGA packages.
Flash memory devices in BGA packages may be damaged if exposed to ultrasonic cleaning m ethods. The
package and/or data integrity may be compromised if the package body is exposed to temperatures above
150°C for prolonged periods of time.
Max
RY/BY#
Considerations for X-ray Inspection of Surface-Mounted Flash Integrated Circuits
V
D a t a
CC
Command
GL512P = A24, A
Register
Control
State
Detector
S h e e t
Max
GL256P = A23, A
PGM Voltage
( A d v a n c e
Generator
Figure 3.1 S29GL-P Block Diagram
Timer
S29GL-P MirrorBit
Max
Sector Switches
GL128P = A22
Erase Voltage
Generator
I n f o r m a t i o n )
STB
TM
Flash Family
Output Enable
Chip Enable
Logic
Y-Decoder
X-Decoder
STB
DQ15
Input/Output
Buffers
Cell Matrix
DQ0 (A-1)
Y-Gating
Latch
Data
7

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