A3PN125-ZVQG100 Actel, A3PN125-ZVQG100 Datasheet - Page 19

• Manufacturer Part Number: A3PN125-ZVQG100
• Description: FPGA - Field Programmable Gate Array 125K System Gates ProASIC3 nano
• Manufacturer: Actel

Specifications of A3PN125-ZVQG100

• Processor Series: A3PN125
• Core: IP Core
• Number Of Macrocells: 1024
• Maximum Operating Frequency: 350 MHz
• Number Of Programmable I/os: 71
• Data Ram Size: 36 Kbit
• Delay Time: 1.02 ns
• Supply Voltage (max): 3.3 V
• Supply Current: 2 mA
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: - 20 C
• Development Tools By Supplier: AGLN-Nano-Kit, AGLN-Z-Nano-Kit, Silicon-Explorer II, Silicon-Sculptor 3, SI-EX-TCA, FloasPro 4, FlashPro 3, FlashPro Lite
• Mounting Style: SMD/SMT
• Supply Voltage (min): 1.5 V
• Number Of Gates: 125 K
• Package / Case: VQFP-100
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Table 2-5 • Package Thermal Resistivities
Table 2-6 • Temperature and Voltage Derating Factors for Timing Delays
Package Type
Quad Flat No Lead (QFN)
Very Thin Quad Flat Pack (VQFP)
Array Voltage VCC (V)
1.425
1.500
1.575
Maximum Power Allowed
(normalized to T
Thermal Characteristics
Introduction
The temperature variable in the Actel Designer software refers to the junction temperature, not the
ambient temperature. This is an important distinction because dynamic and static power consumption
cause the chip junction to be higher than the ambient temperature.
EQ 1
where:
T
ΔT = Temperature gradient between junction (silicon) and ambient ΔT = θ
θ
P = Power dissipation
Package Thermal Characteristics
The device junction-to-case thermal resistivity is θ
θ
temperature is 100°C.
allowed for a 484-pin FBGA package at commercial temperature and in still air.
Temperature and Voltage Derating Factors
A
ja
ja
. The thermal characteristics for θ
= Ambient Temperature
= Junction-to-ambient of the package. θ
T
J
can be used to calculate junction temperature.
= Junction Temperature = ΔT + T
=
J
= 70°C, VCC = 1.425 V)
Max. junction temp. (°C) Max. ambient temp. (°C)
----------------------------------------------------------------------------------------------------------------------------------------- -
–40°C
0.968
0.888
0.836
EQ 2
All devices
All devices
Device
shows a sample calculation of the absolute maximum power dissipation
–20°C
0.973
0.894
0.841
ja
θ
are shown for two air flow rates. The absolute maximum junction
ja
Pin Count
A
(°C/W)
–
100
100
ja
48
68
R e v i s i o n 8
0.979
0.899
0.845
numbers are located in
Junction Temperature (°C)
0°C
jc
TBD
TBD
TBD
10.0
and the junction-to-ambient air thermal resistivity is
θ
jc
0.991
0.910
0.856
25°C
Still Air 200 ft./min.
TBD
TBD
TBD
35.3
Table
1.000
0.919
0.864
=
70°C
100°C 70°C
------------------------------------ -
ja
TBD
TBD
TBD
29.4
20.5°C/W
2-5.
* P
θ
ja
ProASIC3 nano Flash FPGAs
–
1.006
0.924
0.870
85°C
500 ft./min.
=
TBD
TBD
TBD
27.1
1.463 W
100°C
1.013
0.930
0.875
·
Units
C/W
C/W
C/W
C/W
EQ 1
EQ 2
2 -5