LFXP2-8E-5TN144I | |
|---|---|
| Manufacturer Part Number | LFXP2-8E-5TN144I |
| Description | FPGA - Field Programmable Gate Array 8K LUTs 100 I/O Inst on DSP 1.2V -5 Spd |
| Manufacturer | Lattice |
| LFXP2-8E-5TN144I datasheets |
|
Availability: By request
International delivery:
Warranty: 60 days
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- We provide standard 60-days warranty for all parts. If warranty differs we always mention it beforehand. In case of return we cover shipping costs.
- If you still have any questions - please contact us
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Shipping terms
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- For new client payment term is payment in advance. At this moment we accept 3 payment methods: wire transfer, PayPal and Western Union. Credit card payment is under constrution and will be introduced soon. Escrow service is acceptable. Net terms for regular customers is not a problem. Working with us is totally safe for you.
- If you still have any questions - please contact us
Specifications of LFXP2-8E-5TN144I | |||
|---|---|---|---|
| Number Of Macrocells | 8000 | Number Of Programmable I/os | 100 |
| Data Ram Size | 226304 | Supply Voltage (max) | 1.26 V |
| Maximum Operating Temperature | + 100 C | Minimum Operating Temperature | - 40 C |
| Mounting Style | SMD/SMT | Supply Voltage (min) | 1.14 V |
| Package / Case | TQFP-144 | Number Of Logic Elements/cells | * |
| Number Of Labs/clbs | * | Total Ram Bits | 226304 |
| Number Of I /o | 100 | Number Of Gates | - |
| Voltage - Supply | 1.14 V ~ 1.26 V | Mounting Type | * |
| Operating Temperature | -40°C ~ 100°C | Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
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Lattice Semiconductor
Control Logic Block ................................................................................................................................. 2-30
DDR Memory Support...................................................................................................................................... 2-30
DLL Calibrated DQS Delay Block ........................................................................................................... 2-32
Polarity Control Logic .............................................................................................................................. 2-33
DQSXFER............................................................................................................................................... 2-34
sysIO Buffer ..................................................................................................................................................... 2-34
sysIO Buffer Banks ................................................................................................................................. 2-34
Typical sysIO I/O Behavior During Power-up.......................................................................................... 2-35
Supported sysIO Standards .................................................................................................................... 2-35
Hot Socketing.......................................................................................................................................... 2-37
IEEE 1149.1-Compliant Boundary Scan Testability......................................................................................... 2-37
flexiFLASH Device Configuration..................................................................................................................... 2-38
Serial TAG Memory................................................................................................................................. 2-39
Live Update Technology ......................................................................................................................... 2-39
Soft Error Detect (SED) Support ............................................................................................................. 2-40
On-Chip Oscillator................................................................................................................................... 2-40
Density Shifting ................................................................................................................................................ 2-41
DC and Switching Characteristics
Absolute Maximum Ratings ............................................................................................................................... 3-1
Recommended Operating Conditions ................................................................................................................ 3-1
On-Chip Flash Memory Specifications............................................................................................................... 3-1
Hot Socketing Specifications.............................................................................................................................. 3-2
DC Electrical Characteristics.............................................................................................................................. 3-2
Supply Current (Standby)................................................................................................................................... 3-3
Initialization Supply Current ............................................................................................................................... 3-4
Programming and Erase Flash Supply Current ................................................................................................. 3-5
sysIO Recommended Operating Conditions...................................................................................................... 3-6
sysIO Single-Ended DC Electrical Characteristics............................................................................................. 3-7
sysIO Differential Electrical Characteristics ....................................................................................................... 3-8
LVDS......................................................................................................................................................... 3-8
Differential HSTL and SSTL...................................................................................................................... 3-8
LVDS25E .................................................................................................................................................. 3-8
LVCMOS33D ............................................................................................................................................ 3-9
BLVDS .................................................................................................................................................... 3-10
LVPECL .................................................................................................................................................. 3-11
RSDS ...................................................................................................................................................... 3-12
MLVDS.................................................................................................................................................... 3-13
Typical Building Block Function Performance.................................................................................................. 3-14
Pin-to-Pin Performance (LVCMOS25 12mA Drive) ................................................................................ 3-14
Register-to-Register Performance .......................................................................................................... 3-14
Derating Timing Tables .................................................................................................................................... 3-15
LatticeXP2 External Switching Characteristics ................................................................................................ 3-16
LatticeXP2 Internal Switching Characteristics.................................................................................................. 3-19
EBR Timing Diagrams...................................................................................................................................... 3-22
LatticeXP2 Family Timing Adders .................................................................................................................... 3-24
sysCLOCK PLL Timing .................................................................................................................................... 3-27
LatticeXP2 sysCONFIG Port Timing Specifications......................................................................................... 3-28
On-Chip Oscillator and Configuration Master Clock Characteristics................................................................ 3-29
Flash Download Time (from On-Chip Flash to SRAM) .................................................................................... 3-30
Flash Program Time......................................................................................................................................... 3-30
Flash Erase Time ............................................................................................................................................. 3-30
FlashBAK Time (from EBR to Flash) ............................................................................................................... 3-31
JTAG Port Timing Specifications ..................................................................................................................... 3-31
Switching Test Conditions................................................................................................................................ 3-33
LatticeXP2 Family Handbook
2
Table of Contents
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