CSBLA455KJ58-B0 Murata, CSBLA455KJ58-B0 Datasheet - Page 39

• Manufacturer Part Number: CSBLA455KJ58-B0
• Description: Resonators 455kHz 0.5%
• Manufacturer: Murata
• Series: CSBLAr

Specifications of CSBLA455KJ58-B0

• Tolerance: 0.5 %
• Termination Style: SMD/SMT
• Operating Temperature Range: - 20 C to + 80 C
• Dimensions: 3.5 mm W x 7 mm L x 9 mm H
• Frequency: 455 KHz
• Frequency Tolerance: ± 0.5%
• Oscillator Mounting: Through Hole
• No. Of Pins: 2
• Features: Piezoelectric Ceramic
• Rohs Compliant: Yes
• Resonator Case: Radial Leaded
• Resonant Impedance: 30ohm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
1. Soldering
(1) Re-flow soldering
Recommendable Flux and Solder
Recommendable Soldering Profile
(2) Soldering with Iron
Recommendable Soldering with Iron
(3) Solder Volume
(4) etc.
(5) Condition for Placement Machines
Flux
Solder
Pre-heating
Heating
Peak Temperature
Temperature shall be measured on the surface of component.
Heating of the soldering iron
Watt
Shape of the soldering iron
Solering Time
Solder
Soldering and Mounting (CSTCC Series)
Please mount component on a circuit board by re-flow
soldering. Flow soldering is not acceptable.
Be compelled to mount component by using soldering
iron, please do not directly touch the component with
soldering iron. The terminals of component or electrical
characteristics may be damaged if excess thermal stress
is applied.
Please make the solder volume less than the height of
the substrate. When exceeding the substrate, the
damage of adhesive for sealing between the metal cap
and the substrate may occur.
Do not reuse removed component from a circuit board
after soldering.
The component is recommended with placement
machines with employ optical placement capabilities. The
component might be resulted in damage by excessive
mechanical force. Please make sure that you have
evaluated by using placement machines before going into
mass production. Do not use placement machines which
utilize mechanical positioning. Please contact Murata for
details beforehand.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Please use rosin based flux,
but do not use water soluble flux.
Please use solder (Sn-3.0Ag-0.5Cu) under
the following condition. Standard thickness
of soldering paste: 0.10 to 0.15mm
upper limit: 260 C
lower limit: 245 C
150 to 180 C
220 C min.
5s max. at one terminal
Sn-3.0Ag-0.5Cu
350 C max.
ø3mm max.
30W max.
60 to 120s
30 to 60s
1s max.
5s max.
Notice for General Usage -MHz Chip Type-
220
150
260
245
180
(150 to 180 C)
Pre-heating
60 to 120s
Continued on the following page.
(220 C min.)
30 to 60s
Heating
Peak
Gradual
Cooling
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