240-118ABEH-22 Wakefield Thermal Solutions, 240-118ABEH-22 Datasheet

Heatsinks TO-220 LABOR SAVING

240-118ABEH-22

Manufacturer Part Number
240-118ABEH-22
Description
Heatsinks TO-220 LABOR SAVING
Manufacturer
Wakefield Thermal Solutions
Datasheet

Specifications of 240-118ABEH-22

Product
Heatsinks
Mounting Style
SMD/SMT
Heatsink Material
Aluminum
Fin Style
Folded
Thermal Resistance
5.3 C / W
Dimensions
25.4 mm L x 12.7 mm W x 29.97 mm H
Designed For
TO-220
Color
Black
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
Standard
P/N
217-36CT6
217-36CTT6
217-36CTR6
Material: Copper, Tin, Lead Plated
All other products, please contact factory for price, delivery, and minimums.
Board Level
Heat Sinks
MECHANICAL DIMENSIONS
217-36CT6
Height Above
.390 (9.9)
.390 (9.9)
.390 (9.9)
PC Board
in. (mm)
.600 (15.2) x .740 (18.8)
.600 (15.2) x .740 (18.8)
.600 (15.2) x .740 (18.8)
Dimensions
Footprint
in. (mm)
217 HEAT SINK WITH
DDPAK DEVICE
REEL DETAILS
SECTION A-A
KEY:
217 SERIES
Compatible with surface mount technology (SMT) automated production techniques for ease of assembly and a
variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,
increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
component thermal specifications.
FEATURES AND BENEFITS:
• No interface material is needed
• Copper with tin-lead plating for improved solderability and assembly
• Both the component and the heat sink are installed on the PC-board utilizing
• EIA standards and ESD protection are specified
• Can be used with water soluble or no clean SMT solder creams or other pastes
NOTES
3. 250 Pieces per Reel.
217-36CTR6
1. Material to be “ESD”
2. Approximately 6 Meters per Reel
standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats
í
Tape & Reel
Package
Device only, NC
Format
Tube
Bulk
30
Surface Mount Heat Sinks
v
Device + HS, NC
Package
Quantity
250
20
1
125°C LEAD, 40°C AMBIENT
TAPE DETAILS
THERMAL PERFORMANCE
6 LAYER BOARD, D' PAK
Device + HS, 100 lfm
Device Power Dissipation. W
55°C @ 1W
55°C @ 1W
Convection
55°C @ 1W
Natural
Thermal Performance at Typical Load
Device + HS, 200 lfm
Dimensions: in.
D
2
PAK, TO-220, SOT-223, SOL-20
16.0°C/W @ 200 LFM
16.0°C/W @ 200 LFM
16.0°C/W @ 200 LFM
Convection)
Forced
Device + HS, 300 lfm
Normally stocked

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240-118ABEH-22 Summary of contents

Page 1

Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Height Above Footprint Standard PC Board Dimensions P/N in. (mm) in. (mm) 217-36CT6 .390 (9.9) .600 (15.2) x .740 (18.8) 217-36CTT6 .390 (9.9) .600 (15.2) x .740 (18.8) 217-36CTR6 .390 ...

Page 2

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks MECHANICAL DIMENSIONS 217 SERIES TUBE DETAILS TUBE: 16.25 Inches Long, Min. ESDMaterial with Nail Stops 20 Pieces per Tube 217-36CTT6 REF: JEDEC TO-263 (DD PAK) REF: JEDEC MO-169 ...

Page 3

Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 233 AND 236 SERIES Height Above Standard PC Board P/N in. (mm) 233-60AB .600 (15.2) 233-60AB-01 .600 (15.2) 233-60AB-05 .500 (12.7) 233-60AB-10 .725 (18.4) PATENT PENDING 236-150AB 1.500 (38.1) 236-150AB-01 ...

Page 4

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 235 SERIES Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks Height Above Standard PC Board P/N in. (mm) 235-85AB .850 (21.6) 235-85AB-01 .850 (21.6) 235-85AB-05 .500 (12.7) 235-85AB-10 .975 (24.8) PATENT 5381041 Material: Aluminum, Black Anodized ...

Page 5

... MECHANICAL DIMENSIONS 274 SERIES 281 SERIES Dimensions: in. (mm) 240 SERIES Labor-Saving Twisted Fin Heat Sinks Height Above Standard PC Board P/N in. (mm) 240-118ABH-22 1.180 (30.0) 240-118ABS-22 1.180 (30.0) Material: Aluminum, Black Anodized ...

Page 6

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 242 SERIES Low-Height, Low-Profile Twisted Fin Heat Sinks Height Above Standard PC Board P/N in. (mm) 242-125AB-22 1.285 (32.6) Material: Aluminum, Black Anodized 242-125AB-22 MECHANICAL DIMENSIONS 232 AND 238 SERIES Height Above Standard PC ...

Page 7

... LFM .0160 (7.25) 38° 3.2°C/W @ 400 LFM .0170 (7.20) MULTIWATT Thermal Performance at Typical Load Natural Forced Convection Convection lbs. (grams) 35° 2.8°C/W @ 400 LFM .0240 (10.90) 35° 2.8°C/W @ 400 LFM .0250 (11.40) Normally stocked Weight Weight Weight ...

Page 8

BOARD LEVEL HEAT SINKS FOR TO-220, TO-218 AND M 247 SERIES Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks Height Above Standard PC Board P/N in. (mm) 247-195AB 1.950 (49.5) 247-195AB-50 1.950 (49.5) Order SpeedClip™ 285SC or 330SC separately. ...

Page 9

Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 288 SERIES Compact Wave-Solderable Low-Cost Heat Sinks Standard P/N 288-1AB Mounting tabs are pre-tinned to ensure excellent wave-solder bond and good electrical connections for vertical mounting of TO-220 and TO-202 ...

Page 10

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 270/272/280 SERIES Height Above Standard PC Board P/N in. (mm) 270-AB 0.375 (9.4) 272-AB 0.375 (9.4) 280-AB 0.375 (9.4) Material: Aluminum, Black Anodized These exceptionally low-cost heat sinks can be mounted horizontally under a ...

Page 11

Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 250 SERIES High-Performance Slim Profile Heat Sinks With Integral Clips Height Above Standard PC Board P/N in. (mm) 250-122AB 1.220 (31.0) 250-122AB-09 1.220 (31.0) 250-122AB-25 1.380 (35.1) Material: Aluminum, Black ...

Page 12

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 286 SERIES Aluminum and Copper Low-Cost Wave-Solderable Heat Sinks Height Above Standard PC Board P/N in. (mm) 286-AB 1.190 (30.2) 286-CBT 1.190 (30.2) 286-CT 1.190 (30.2) Efficient heat removal at low cost can be ...

Page 13

Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 256 SERIES Thermal Retainers Height (Less Standard Mounting Tab) P/N in. (mm) 256-DM 0.190 (4.0) Cup Clips for TO-5 Case Style Semiconductors 260 SERIES Characteristics Thermal Resistance – Epoxy Insulated ...

Page 14

... Types in. (mm) in. (mm) 201CB, 201AB 0.161 (4.1)/0.240 (6.1) 0.150 (3.8) 202CB 0.161 (4.1)/0.240 (6.1) 0.150 (3.8) 203CB 0.161 (4.1)/0.240 (6.1) 0.150 (3.8) 204CB , 204SB 0.275 (7.0)/0.370 (9.4) 0.255 (6.5) 205CB , 205SB 0.275 (7.0)/0.370 (9.4) 0.255 (6.5) 205AB, 205AP 0,275 (7 ...

Page 15

Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 634 SERIES Slim Profile Unidirectional Fin Vertical Mount Heat Sink Standard P/N Plain Pin 634-10ABP 634-15ABP 634-20ABP Material: Aluminum, Black Anodized. These slim profile unidirectional fin heat sinks offer users ...

Page 16

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Page 17

Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 626 AND 627 SERIES Standard Standard P/N 626-10ABP 627-10ABP 626-15ABP 627-15ABP 626-20ABP 627-20ABP 626-25ABP 627-25ABP Wave-solderable pins. Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS Dimensions: in. (mm) 657 SERIES High-Performance Heat ...

Page 18

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 657 SERIES High-Performance Notched Heat Sinks for Vertical Board Mounting Standard P/N 657-10ABPN 657-15ABPN 657-20ABPN 657-25ABPN Wave-solderable pins. Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS Dimensions: in. (mm) 657 SERIES High-Performance Heat Sinks with SpeedClips™ ...

Page 19

Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 690 SERIES HIghest Efficiency/Lowest Unit Cost Heat Sinks Height Above Standard P/N 690-3B 1.310 (33.3) 690-66B 1.310 (33.3) 690-220B 1.310 (33.3) Material: Aluminum, Black Anodized These low-cost heat sinks provide ...

Page 20

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 601 AND 603 SERIES Standard Dimensions P/N 601E 2.000 (50.8) x 1.250 (31.8) 601F 2.000 (50.8) x 1.250 (31.8) 601K 2.000 (50.8) x 1.250 (31.8) 603K 2.000 (50.8) x 2.000 (50.8) Material: Aluminum Alloy, ...

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