GRM32ER61A226KE20K Murata Electronics North America, GRM32ER61A226KE20K Datasheet - Page 157

• Manufacturer Part Number: GRM32ER61A226KE20K
• Description: CAP CER X5R 1210
• Manufacturer: Murata Electronics North America
• Series: GRMr

Specifications of GRM32ER61A226KE20K

• Voltage - Rated: 10V
• Lead Style: *
• Capacitance: 22µF
• Tolerance: ±10%
• Temperature Coefficient: X5R
• Mounting Type: *
• Operating Temperature: -55°C ~ 85°C
• Applications: General Purpose
• Package / Case: *
• Size / Dimension: *
• Thickness: *
• Lead Spacing: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Ratings: -

!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
5. Break Strength
(1) Test Method
(2) Test Samples
(3) Acceptance Criteria
(4) Explanation
(5) Results
6. Thermal Shock
(1) Test method
(2) Test samples
(3) Acceptance criteria
Place the chip on a steel plate as illustrated on the right.
Increase load applied to a point near the center of the
test sample.
GRM21 5C/R7/F5 Characteristics
GRM31 5C/R7/F5 Characteristics
Define the load that has caused the chip to break or
crack, as the bending force.
Break strength, P, is proportionate to the square of the
thickness of the ceramic element and is expressed as a
curve of secondary degree.
The formula is:
W : Width of ceramic element
T : Thickness of element
L : Distance between fulcrums
After applying flux (an ethanol solution of 25% rosin), dip
the chip in a solder bath (6Z4 eutectic solder) in
accordance with the following
conditions:
GRM21 5C/R7/F5 Characteristics T=0.6mm typical
Visually inspect the test sample with a 60-power optical
microscope. Chips exhibiting breaks or cracks should be
determined to be defective.
Continued from the preceding page.
: Bending stress
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
P=
2 WT
3L
140
120
100
80
60
40
20
0
2
0
GRM21
(N)
Thickness of Ceramic Element (mm)
0.4
5C
0.8
(mm)
(mm)
(mm)
(N/mm
R7
2
)
1.2
F5
1.6
Storage
scope
L
140
120
100
80
60
40
20
0
0
GRM31
Dipping Speed: 25mm/sec.
Amplifier
W
T
Load cell
Thickness of Ceramic Element (mm)
GRM21
GRM31
Chip Size L
0.4
P Pressurizing
Chip Capacitor
Solder Bath
speed: 2.5mm/sec.
Sample
1.5 1.2
2.7 1.5
0.8
Steel plate
W
25D
5C
Continued on the following page.
Charac-
teristics
Reference Data
300
5C
R7
1.2
T
F5
Charac-
teristics
2 sec.
Loading Jig End
180
R7
Solder
Temperature
1.6
Charac-
teristics
Natural
Cooling
P0.5mm
160
F5
(in mm)
1.0mm
Time
155
C02E.pdf
10.12.20