BAS16LD,315 NXP Semiconductors, BAS16LD,315 Datasheet

DIODE SW 100V SOD-882D

BAS16LD,315

Manufacturer Part Number
BAS16LD,315
Description
DIODE SW 100V SOD-882D
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BAS16LD,315

Diode Type
Standard
Voltage - Forward (vf) (max) @ If
1.25V @ 150mA
Voltage - Dc Reverse (vr) (max)
100V
Current - Average Rectified (io)
215mA (DC)
Current - Reverse Leakage @ Vr
500µA @ 80V
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr)
4ns
Capacitance @ Vr, F
1.5pF @ 0V, 1MHz
Mounting Type
Surface Mount
Package / Case
2-XDFN
Product
Switching Diodes
Peak Reverse Voltage
100 V
Forward Continuous Current
215 mA
Max Surge Current
4 A
Configuration
Single
Recovery Time
4 ns
Maximum Power Dissipation
250 mW
Operating Temperature Range
- 55 C to + 150 C
Maximum Diode Capacitance
1.5 pF
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 55 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
568-5294-2
1. Product profile
1.1 General description
1.2 Features and benefits
1.3 Applications
1.4 Quick reference data
Single high-speed switching diode, encapsulated in a SOD882D leadless ultra small
Surface-Mounted Device (SMD) plastic package with visible and solderable side pads.
Table 1.
[1]
[2]
Symbol
I
I
V
t
F
R
rr
R
BAS16LD
Single high-speed switching diode
Rev. 1 — 12 October 2010
High switching speed: t
Low leakage current
Repetitive peak reverse voltage:
V
AEC-Q101 qualified
High-speed switching
General-purpose switching
Device mounted on an FR4 Printed-Circuit Board (PCB) with 60 μm copper strip line.
When switched from I
RRM
≤ 100 V
Quick reference data
Parameter
forward current
reverse current
reverse voltage
reverse recovery time
F
= 10 mA to I
rr
≤ 4 ns
R
= 10 mA; R
V
Conditions
R
= 80 V
L
= 100 Ω; measured at I
Low capacitance
Reverse voltage: V
Ultra small and leadless SMD plastic
package
Solderable side pads
[1]
[2]
Min
-
-
-
-
R
= 1 mA.
Typ
-
-
-
-
Product data sheet
R
≤ 100 V
Max
215
0.5
100
4
V
Unit
mA
μA
ns

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BAS16LD,315 Summary of contents

Page 1

BAS16LD Single high-speed switching diode Rev. 1 — 12 October 2010 1. Product profile 1.1 General description Single high-speed switching diode, encapsulated in a SOD882D leadless ultra small Surface-Mounted Device (SMD) plastic package with visible and solderable side pads. 1.2 ...

Page 2

... NXP Semiconductors 2. Pinning information Table 2. Pin 1 2 [1] The marking bar indicates the cathode. 3. Ordering information Table 3. Type number BAS16LD 4. Marking Table 4. Type number BAS16LD [1] For SOD882D binary marking code description, see 4.1 Binary marking code description Fig 1. BAS16LD Product data sheet ...

Page 3

... NXP Semiconductors 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V RRM FRM I FSM P tot amb T stg Device mounted on an FR4 PCB with 60 μm copper strip line. [ °C prior to surge. [ [3] Reflow soldering is the only recommended soldering method. ...

Page 4

... NXP Semiconductors 7. Characteristics Table amb Symbol [1] Pulse test: t [2] When switched from I [3] When switched from I BAS16LD Product data sheet Characteristics ° C unless otherwise specified. Parameter Conditions forward voltage 150 mA F reverse current diode capacitance MHz; V reverse recovery time forward recovery voltage ≤ ...

Page 5

... NXP Semiconductors (mA (1) (2) (3) 1 − 0.2 0.4 0.6 0.8 = 150 °C (1) T amb = 85 °C (2) T amb = 25 °C (3) T amb = −40 °C (4) T amb Fig 2. Forward current as a function of forward voltage; typical values (1) (μA) 10 (2) 1 −1 10 (3) −2 10 −3 10 −4 10 (4) −5 ...

Page 6

... NXP Semiconductors 8. Test information D.U. Ω × ( Input signal: reverse pulse rise time t Oscilloscope: rise time Fig 6. Reverse recovery time test circuit and waveforms I 450 Ω 1 kΩ Ω D.U.T. Input signal: forward pulse rise time t Fig 7. Forward recovery voltage test circuit and waveforms ...

Page 7

... NXP Semiconductors 9. Package outline Fig 8. 10. Packing information Table 8. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package BAS16LD [1] For further information and the availability of packing methods, see 11. Soldering Fig 9. BAS16LD Product data sheet 0.65 ...

Page 8

... NXP Semiconductors 12. Revision history Table 9. Revision history Document ID Release date BAS16LD v.1 20101012 BAS16LD Product data sheet Data sheet status Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 12 October 2010 BAS16LD Single high-speed switching diode Change notice ...

Page 9

... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...

Page 10

... NXP Semiconductors Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 14. Contact information For more information, please visit: For sales office addresses, please send an email to: ...

Page 11

... NXP Semiconductors 15. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4.1 Binary marking code description Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 10 Packing information ...

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