STM32F101TBU6 STMicroelectronics, STM32F101TBU6 Datasheet - Page 46

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STM32F101TBU6

Manufacturer Part Number
STM32F101TBU6
Description
IC ARM CORTEX MCU 128KB 36VFQFPN
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet

Specifications of STM32F101TBU6

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
36MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
26
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 10x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
36-VFQFN Exposed Pad
Core
ARM Cortex M3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

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Electrical characteristics
46/87
Table 21.
1. Resonator characteristics given by the crystal/ceramic resonator manufacturer.
2. Based on characterization, not tested in production.
3. The relatively low value of the RF resistor offers a good protection against issues resulting from use in a
4. t
For C
5 pF to 25 pF range (typ.), designed for high-frequency applications, and selected to match
the requirements of the crystal or resonator (see
same size. The crystal manufacturer typically specifies a load capacitance which is the
series combination of C
can be used as a rough estimate of the combined pin and board capacitance) when sizing
C
microcontrollers” available from the ST website www.st.com.
Figure 21. Typical application with an 8 MHz crystal
1. R
Low-speed external clock generated from a crystal/ceramic resonator
The low-speed external (LSE) clock can be supplied with a 32.768 kHz crystal/ceramic
resonator oscillator. All the information given in this paragraph are based on characterization
results obtained with typical external components specified in
the resonator and the load capacitors have to be placed as close as possible to the oscillator
pins in order to minimize output distortion and startup stabilization time. Refer to the crystal
t
SU(HSE)
L1
Symbol
f
OSC_IN
humid environment, due to the induced leakage and the bias condition change. However, it is
recommended to take this point into account if the MCU is used in tough humidity conditions.
oscillation is reached. This value is measured for a standard crystal resonator and it can vary significantly
with the crystal manufacturer
SU(HSE)
Resonator with
integrated capacitors
R
g
and C
EXT
C
i
2
m
L1
F
value depends on the crystal characteristics.
(4)
and C
is the startup time measured from the moment it is enabled (by software) to a stabilized 8 MHz
L2
Oscillator frequency
Feedback resistor
Recommended load capacitance
versus equivalent serial
resistance of the crystal (R
HSE driving current
Oscillator transconductance
Startup time
. Refer to the application note AN2867 “Oscillator design guide for ST
HSE 4-16 MHz oscillator characteristics
L2
, it is recommended to use high-quality external ceramic capacitors in the
C L2
C L1
Parameter
L1
8 MH z
resonator
R EXT (1)
and C
Doc ID 13586 Rev 14
L2
. PCB and MCU pin capacitance must be included (10 pF
OSC_OU T
S
OSC_IN
)
(3)
R
V
with 30 pF load
Startup
V
R F
DD
S
DD
= 30 Ω
= 3.3 V, V
Conditions
is stabilized
controlled
Figure
Bias
gain
(1)(2)
IN
21). C
= V
STM32F101x8, STM32F101xB
SS
STM32F10xxx
Table
L1
and C
Min
f HSE
25
4
22. In the application,
L2
Typ
200
30
2
are usually the
8
Max
16
1
ai14128b
mA/V
MHz
Unit
mA
ms
pF

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