STM32F101ZGT6 STMicroelectronics, STM32F101ZGT6 Datasheet - Page 14

IC ARM CORTEX 1MB 144LQFP

STM32F101ZGT6

Manufacturer Part Number
STM32F101ZGT6
Description
IC ARM CORTEX 1MB 144LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet

Specifications of STM32F101ZGT6

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
36MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
112
Program Memory Size
1MB (1M x 8)
Program Memory Type
FLASH
Ram Size
80K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LFQFP
Processor Series
STM32F101xG
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
80 KB
Interface Type
I2C, SPI, UART
Maximum Clock Frequency
36 MHz
Number Of Programmable I/os
112
Number Of Timers
15
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Operating Temperature Range
- 40 C to + 105 C
Processor To Be Evaluated
STM32F101ZG
Supply Current (max)
28 mA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

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Description
2.2
Table 3.
1. For orderable part numbers that do not show the A internal code after the temperature range code (6), the reference
14/108
Pinout
144
100
64
48
36
datasheet for electrical characteristics is that of the STM32F101x8/B medium-density devices.
4 KB RAM 6 KB RAM 10 KB RAM 16 KB RAM
2 × USARTs
2 × 16-bit timers
1 × SPI, 1 × I
1 × ADC
Low-density devices
16 KB
Flash
Full compatibility throughout the family
The STM32F101xx is a complete family whose members are fully pin-to-pin, software and
feature compatible. In the reference manual, the STM32F101x4 and STM32F101x6 are
identified as low-density devices, the STM32F101x8 and STM32F101xB are referred to as
medium-density devices, the STM32F101xC, STM32F101xD, STM32F101xE are referred
to as high-density devices, and the STM32F101xF and STM32F101xG are referred to as
XL-density devices.
Low-, high-density and XL-density devices are an extension of the STM32F101x8/B
medium-density devices, they are specified in the STM32F101x4/6, STM32F101xC/D/E and
STM32F101xF/G datasheets, respectively.
Low-density devices feature lower Flash memory and RAM capacities, less timers and
peripherals. High-density devices have higher Flash memory and RAM densities, and
additional peripherals like FSMC and DAC. XL-density devices bring greater Flash and RAM
capacities, and more features, namely an MPU, a higher number of timers and a dual bank
Flash memory, while remaining fully compatible with the other members of the family.
The STM32F101x4, STM32F101x6, STM32F101xC, STM32F101xD, STM32F101xE,
STM32F101xF and STM32F101xG are a drop-in replacement for the STM32F101x8/B
devices, allowing the user to try different memory densities and providing a greater degree
of freedom during the development cycle.
Moreover, the STM32F101xx access line family is fully compatible with all existing
STM32F103xx performance line and STM32F102xx USB access line devices.
STM32F101xx family
2
Flash
C
32 KB
(1)
3 × USARTs
3 × 16-bit timers
2 × SPIs, 2 × I2Cs,
1 × ADC
Medium-density devices
64 KB
Flash
Doc ID 17143 Rev 2
128 KB
Flash
Memory size
256 KB
5 × USARTs
4 × 16-bit timers,
2 × basic timers
3 × SPIs, 2 × I
1 × ADC, 1 × DAC
FSMC (100 and 144 pins)
32 KB
Flash
RAM
High-density devices
384 KB
48 KB
Flash
RAM
2
Cs,
STM32F101xF, STM32F101xG
512 KB
48 KB
Flash
RAM
5 × USARTs
10 × 16-bit timers,
2 × basic timers
3 × SPIs, 2 × I
1 × ADC, 1 × DAC
FSMC (100 and 144
pins), Cortex-M3 with
MPU, Dual bank Flash
memory
768 KB
XL-density devices
80 KB
Flash
RAM
2
80 KB
Cs,
Flash
1 MB
RAM

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