STM32F101ZGT6 STMicroelectronics, STM32F101ZGT6 Datasheet - Page 38

• Manufacturer Part Number: STM32F101ZGT6
• Description: IC ARM CORTEX 1MB 144LQFP
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F101ZGT6

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 36MHz
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
• Number Of I /o: 112
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• Ram Size: 80K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LFQFP
• Processor Series: STM32F101xG
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 80 KB
• Interface Type: I2C, SPI, UART
• Maximum Clock Frequency: 36 MHz
• Number Of Programmable I/os: 112
• Number Of Timers: 15
• Operating Supply Voltage: 2 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Operating Temperature Range: - 40 C to + 105 C
• Processor To Be Evaluated: STM32F101ZG
• Supply Current (max): 28 mA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

Electrical characteristics
5.3
5.3.1
5.3.2
5.3.3
38/108
Operating conditions
General operating conditions
Table 10.
1. When the ADC is used, refer to
2. It is recommended to power V
3. If T
4. In low power dissipation state, T
Operating conditions at power-up / power-down
The parameters given in
temperature condition summarized in
Table 11.
Embedded reset and power control block characteristics
The parameters given in
temperature and V
Symbol
Symbol
V
f
f
f
PCLK1
PCLK2
between V
characteristics on page
Table 6.2: Thermal characteristics on page
V
DDA
t
HCLK
V
VDD
P
T
T
BAT
DD
A
D
J
A
(1)
is lower, higher P
Internal AHB clock frequency
Internal APB1 clock frequency
Internal APB2 clock frequency
Standard operating voltage
Analog operating voltage
(ADC not used)
Analog operating voltage
(ADC used)
Backup operating voltage
Power dissipation at T
85 °C
Ambient temperature
Junction temperature range
V
V
DD
General operating conditions
Operating conditions at power-up / power-down
DD
DD
and V
rise time rate
fall time rate
(3)
Parameter
DD
DDA
Parameter
D
supply voltage conditions summarized in
104).
can be tolerated during power-up and operation.
values are allowed as long as T
Table 11
Table 12
DD
A
Table 55: ADC
and V
can be extended to this range as long as T
Doc ID 17143 Rev 2
A
=
are derived from tests performed under the ambient
are derived from tests performed under ambient
DDA
Table
104).
from the same source. A maximum difference of 300 mV
characteristics.
Must be the same potential
as V
LQFP144
LQFP100
LQFP64
Maximum power dissipation
Low power dissipation
10.
Conditions
DD
J
(2)
does not exceed T
Conditions
STM32F101xF, STM32F101xG
(4)
Table
J
J
max (see
does not exceed T
Min
10.
20
0
Min
–40
–40
–40
2.4
1.8
0
0
0
2
2
Table 6.2: Thermal
Max
Max
666
434
444
105
105
3.6
3.6
3.6
3.6


36
36
36
85
J
max (see
MHz
Unit
mW
Unit
µs/V
°C
°C
°C
V
V
V