FAN3216TMX Fairchild Semiconductor, FAN3216TMX Datasheet - Page 2

• Manufacturer Part Number: FAN3216TMX
• Description: IC GATE DRIVER DUAL 2A 8-SOIC
• Manufacturer: Fairchild Semiconductor
• Type: Low Side Gate Driversr

Specifications of FAN3216TMX

• Product: MOSFET Gate Drivers
• Rise Time: 12 ns
• Fall Time: 9 ns
• Propagation Delay Time: 19 ns
• Supply Voltage (max): 18 V
• Supply Voltage (min): 4.5 V
• Supply Current: 0.75 mA
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Package / Case: SOIC-8
• Minimum Operating Temperature: - 40 C
• Output Current: 2.4 A
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

© 2009 Fairchild Semiconductor Corporation
FAN3216 / FAN3217 • Rev. 1.0.1
Package Outlines
Thermal Characteristics
8-Pin Small Outline Integrated Circuit (SOIC)
Notes:
1.
2.
3.
4.
5.
6.
Estimates derived from thermal simulation; actual values depend on the application.
Theta_JL (
thermal pad) that are typically soldered to a PCB.
Theta_JT (
held at a uniform temperature by a top-side heatsink.
Theta_JA (Θ
The value given is for natural convection with no heatsink using a 2S2P board, as specified in JEDEC standards JESD51-2,
JESD51-5, and JESD51-7, as appropriate.
Psi_JB (
application circuit board reference point for the thermal environment defined in Note 4. For the SOIC-8 package, the board
reference is defined as the PCB copper adjacent to pin 6.
Psi_JT (
the center of the top of the package for the thermal environment defined in Note 4.


JB
JT


): Thermal characterization parameter providing correlation between the semiconductor junction temperature and
): Thermal characterization parameter providing correlation between semiconductor junction temperature and an
JL
JT
JA
): Thermal resistance between the semiconductor junction and the bottom surface of all the leads (including any
): Thermal resistance between the semiconductor junction and the top surface of the package, assuming it is
): Thermal resistance between junction and ambient, dependent on the PCB design, heat sinking, and airflow.
Package
(1)
Figure 2. SOIC-8 (Top View)
2

40
JL
(2)

31
JT
(3)

JA
89
(4)

JB
43
(5)

3.0
JT
www.fairchildsemi.com
(6)
Units
°C/W