74CBTLV3253D,118 NXP Semiconductors, 74CBTLV3253D,118 Datasheet
74CBTLV3253D,118
Specifications of 74CBTLV3253D,118
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74CBTLV3253D,118 Summary of contents
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Dual 1-of-4 multiplexer/demultiplexer Rev. 3 — 7 January 2011 1. General description The 74CBTLV3253 provides a dual 1-of-4 high-speed multiplexer/demultiplexer with two common select inputs (S0, S1) and two output enable inputs (1OE, 2OE). The low ON resistance of ...
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... NXP Semiconductors 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name −40 °C to +125 °C 74CBTLV3253D −40 °C to +85 °C 74CBTLV3253DS 74CBTLV3253PW −40 °C to +125 °C −40 °C to +125 °C 74CBTLV3253BQ [1] Also known as QSOP16. 4. Functional diagram 1OE 15 2OE Fig 1. ...
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... NXP Semiconductors 5. Pinning information 5.1 Pinning 74CBTLV3253 1 16 1OE 2OE 3 14 1B4 S0 1B3 4 13 2B4 1B2 5 12 2B3 1B1 6 11 2B2 2B1 8 9 GND 2A 001aal209 Fig 2. Pin configuration SOT109-1 (SO16) and SOT519-1 (SSOP16) 5.2 Pin description Table 2. Pin description Symbol Pin ...
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... NXP Semiconductors 6. Functional description [1] Table 3. Function table Inputs 1OE 2OE [ HIGH voltage level LOW voltage level. 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter V supply voltage CC V input voltage ...
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... NXP Semiconductors 9. Static characteristics Table 6. Static characteristics At recommended operating conditions voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions V HIGH-level input voltage LOW-level input voltage input leakage pin nOE current OFF-state V = 3.6 V; see S(OFF) CC leakage current ...
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... NXP Semiconductors 9.2 ON resistance Table 7. Resistance recommended operating conditions; voltages are referenced to GND (ground = 0 V); for test circuit see Symbol Parameter Conditions R ON resistance see Figure see Figure [1] Typical values are measured at T [2] Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is determined by the lower of the voltages of the two ( terminals ...
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... NXP Semiconductors (Ω (1) 5 (2) (3) ( 0.5 1.0 = 125 °C. (1) T amb = 85 °C. (2) T amb = 25 °C. (3) T amb = −40 °C. (4) T amb Fig 9. ON resistance as a function of input voltage 2 (Ω) 6 (1) (2) ( 125 °C. (1) T amb = 85 °C. (2) T amb = 25 °C. (3) T amb = − ...
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... NXP Semiconductors = 125 °C. (1) T amb = 85 °C. (2) T amb = 25 °C. (3) T amb = −40 °C. (4) T amb Fig 13. ON resistance as a function of input voltage; V 74CBTLV3253 Product data sheet 7 (Ω) 6.5 5.5 (1) (2) 4.5 (3) 3.5 ( All information provided in this document is subject to legal disclaimers. ...
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... NXP Semiconductors 10. Dynamic characteristics Table 8. Dynamic characteristics GND = 0 V; for test circuit see Figure 16 Symbol Parameter Conditions t propagation delay nA to nBn or nBn to nA; pd see nA; see enable time nOE nBn; en see nBn; see disable time nOE nBn; dis see nBn; see V V [1] ...
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... NXP Semiconductors 11. Waveforms Measurement points are given in Logic levels: V and Fig 14. The data input (nA or nBn) to output (nBn or nA) propagation delays Table 9. Measurement points Supply voltage Input 2 2.7 V 0. 3.6 V 0.5V CC nOE, Sn input LOW-to-OFF OFF-to-LOW HIGH-to-OFF OFF-to-HIGH Measurement points are given in ...
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... NXP Semiconductors Test data is given in Table Definitions for test circuit Load resistance Load capacitance including jig and probe capacitance Termination resistance should be equal to the output impedance External voltage for measuring switching times. EXT Fig 16. Test circuit for measuring switching times Table 10. ...
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... NXP Semiconductors 12. Package outline SO16: plastic small outline package; 16 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors SSOP16: plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.25 1.55 mm 1.73 0.25 0.10 1.40 Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION ...
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... NXP Semiconductors TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 16 terminals; body 2.5 x 3.5 x 0.85 mm terminal 1 index area terminal 1 index area DIMENSIONS (mm are the original dimensions) (1) A UNIT max. 0.05 0. 0.2 0.00 0.18 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. ...
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... NXP Semiconductors 13. Abbreviations Table 11. Abbreviations Acronym Description CDM Charged Device Model CMOS Complementary Metal-Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model 14. Revision history Table 12. Revision history Document ID Release date 74CBTLV3253 v.3 20110107 • Modifications: Section 74CBTLV3253 v ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 16. Contact information For more information, please visit: For sales office addresses, please send an email to: 74CBTLV3253 Product data sheet 15 ...
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... NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Functional description . . . . . . . . . . . . . . . . . . . 4 7 Limiting values Recommended operating conditions Static characteristics 9.1 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 9.2 ON resistance . . . . . . . . . . . . . . . . . . . . . . . . . . 6 9.3 ON resistance test circuit and graphs Dynamic characteristics ...