RC28F256P30BFA NUMONYX, RC28F256P30BFA Datasheet - Page 18

• Manufacturer Part Number: RC28F256P30BFA
• Description: IC FLASH 256MBIT 100NS 64EZBGA
• Manufacturer: NUMONYX
• Series: Axcell™r

Specifications of RC28F256P30BFA

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 256M (16Mx16)
• Speed: 100ns
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 2 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-EZBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: 898885; 898885; RC28F256P30BF 898885

Table 6:
4.1
Figure 9:
Figure 10: 512-Mbit QUAD+ SCSP Block Diagram
Note:
Datasheet
18
VCC
VCCQ
VSS
RFU
DU
NC
Symbol
A
max
QUAD+ SCSP Signal Descriptions (Sheet 2 of 2)
512-Mbit Easy BGA Block Diagram
= V
Dual-Die Configurations
Power
Power
Power
Type
—
—
—
IH
selects the Top parameter Die; A
DEVICE CORE POWER SUPPLY: Core (logic) source voltage. Writes to the flash array are inhibited
when V
OUTPUT POWER SUPPLY: Output-driver source voltage.
GROUND: Connect to system ground. Do not float any VSS connection.
RESERVED FOR FUTURE USE: Reserved by Numonyx for future device functionality and
enhancement. These should be treated in the same way as a Do Not Use (DU) signal.
DO NOT USE: Do not connect to any other signal, or power supply; must be left floating.
NO CONNECT: No internal connection; can be driven or floated.
A[MAX:1]
A[MAX:0]
F1-CE#
ADV#
WP#
WE#
ADV#
OE#
CE#
CLK
WP#
WE#
OE#
CLK
CC
Easy BGA 512-Mbit (Dual-Die) Top or Bottom Parameter
≤ V
QUAD+ 512-Mbit (Dual-Die) Top or Bottom Parameter
LKO
. Operations at invalid V
Bottom Param Die
Bottom Param Die
Top Param Die
Top Param Die
Configuration
Configuration
(256-Mbit)
(256-Mbit)
(256-Mbit)
(256-Mbit)
max
Name and Function
CC
voltages should not be attempted.
= V
IL
selects the Bottom Parameter Die.
RST#
VCC
VPP
VCCQ
VSS
DQ[15:0]
WAIT
RST#
VCC
VPP
VCCQ
VSS
DQ[15:0]
WAIT
Order Number: 320002-10
P30-65nm
Mar 2010