GRM31CR61E226KE15L Murata, GRM31CR61E226KE15L Datasheet - Page 154

Multilayer Ceramic Capacitors (MLCC) - SMD/SMT 1206 X5R 25V 22uF

GRM31CR61E226KE15L

Manufacturer Part Number
GRM31CR61E226KE15L
Description
Multilayer Ceramic Capacitors (MLCC) - SMD/SMT 1206 X5R 25V 22uF
Manufacturer
Murata
Series
GRMr
Datasheet

Specifications of GRM31CR61E226KE15L

Voltage Rating
25 Volts
Operating Temperature Range
- 55 C to + 85 C
Temperature Coefficient / Code
X5R
Product
Automotive MLCCs
Dimensions
1.6 mm W x 3.2 mm L x 1.6 mm H
Termination Style
SMD/SMT
Capacitance
22 uF
Tolerance
10 %
Package / Case
1206 (3216 metric)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
GRM31CR61E226KE15L
Manufacturer:
MURATA
Quantity:
600 000
Part Number:
GRM31CR61E226KE15L
Manufacturer:
MURATA/村田
Quantity:
20 000
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
(4) Results
3. Temperature Cycling for Solder Fillet Height
(1) Test Method
152
Reference Data
Solder the chips to the substrate of various test fixtures
using sufficient amounts of solder to achieve the required
fillet height. Then subject the fixtures to the cycle
illustrated at right 200 times.
q Solder Amount
w Material
e Land Dimension
Continued from the preceding page.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Alumina substrates are typically designed for reflow
soldering.
Glass epoxy or paper phenol substrates are typically
used for flow soldering.
Alumina
Glass epoxy
Paper phenol (Thickness: 1.64mm)
100
100
80
60
40
20
80
60
40
20
0
0
(Thickness: 0.64mm)
(Thickness: 1.64mm)
0
0
GRM21 5C (T=0.6)
GRM21 F5 (T=0.6)
Larger Fillet
Larger Fillet
2
2
Flexure (mm)
Flexure (mm)
4
4
Fillet up to Chip
Thickness
Fillet up to Chip
Thickness
6
6
8
8
[Temperature Cycling]
[Solder Amount]
[Land Dimension]
Solder to be used
Room Temperature
100
Substrate
80
60
40
20
0
0
GRM21 R7 (T=0.6)
Larger Fillet
1.5
q
w
e
+125D
-55D
1.2
2
(in mm)
1.5
Flexure (mm)
Alumina
5
4
Fillet up to Chip
Thickness
30
6Z4 Eutectic solder
Land Pattern
Glass Epoxy
Paper Phenol
Substrate
Substrate
Substrate
Alumina
5
Continued on the following page.
6
30
or Paper Phenol
Time (min.)
8
Glass Epoxy
Ag/Pd=72/28
Thickness: 10 to 12 m
Cu
Thickness: 35 m
C02E.pdf
10.12.20

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