IC, OP-AMP, 100MHZ, 3000V/µs, SOIC-8

LM6172IMX

Manufacturer Part NumberLM6172IMX
DescriptionIC, OP-AMP, 100MHZ, 3000V/µs, SOIC-8
ManufacturerNational Semiconductor
LM6172IMX datasheet
 


Specifications of LM6172IMX

Op Amp TypeLow PowerNo. Of Amplifiers2
Bandwidth100MHzSlew Rate3000V/µs
Supply Voltage Range5.5V To 36VAmplifier Case StyleSOIC
No. Of Pins8Lead Free Status / RoHS StatusContains lead / RoHS non-compliant
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Application Notes
(Continued)
POWER SUPPLY BYPASSING
Bypassing the power supply is necessary to maintain low
power supply impedance across frequency. Both positive
and negative power supplies should be bypassed individu-
ally by placing 0.01µF ceramic capacitors directly to power
supply pins and 2.2µF tantalum capacitors close to the
power supply pins.
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FIGURE 5. Power Supply Bypassing
TERMINATION
In high frequency applications, reflections occur if signals
are not properly terminated. Figure 6 shows a properly ter-
minated signal while Figure 7 shows an improperly termi-
nated signal.
FIGURE 6. Properly Terminated Signal
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FIGURE 7. Improperly Terminated Signal
To minimize reflection, coaxial cable with matching charac-
teristic impedance to the signal source should be used. The
other end of the cable should be terminated with the same
value terminator or resistor. For the commonly used cables,
RG59 has 75Ω characteristic impedance, and RG58 has
50Ω characteristic impedance.
POWER DISSIPATION
The maximum power allowed to dissipate in a device is
defined as:
P
Where P
is the power dissipation in a device
D
T
is the maximum junction temperature
J(max)
T
is the ambient temperature
A
θ
is the thermal resistance of a particular package
JA
For example, for the LM6172 in a SO-8 package, the maxi-
mum power dissipation at 25˚C ambient temperature is
780mW.
Thermal resistance, θ
die size, package size and package material. The smaller
the die size and package, the higher θ
DIP package has a lower thermal resistance (95˚C/W) than
that of 8-pin SO (160˚C/W). Therefore, for higher dissipation
capability, use an 8-pin DIP package.
The total power dissipated in a device can be calculated as:
P
is the quiescent power dissipated in a device with no load
Q
connected at the output. P
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device with a load connected at the output; it is not the power
dissipated by the load.
Furthermore,
P
:
= supply current x total supply voltage with no load
Q
P
: =
output current x (voltage difference between supply
L
voltage and output voltage of the same supply)
For example, the total power dissipated by the LM6172 with
±
V
=
15V and both channels swinging output voltage of
S
10V into 1kΩ is
P
: = P
+ P
D
Q
L
: =
2[(2.3mA)(30V)] + 2[(10mA)(15V − 10V)]
: =
138mW + 100mW
: =
238mW
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= (T
− T
)/θ
D
J(max)
A
JA
, depends on parameters such as
JA
becomes. The 8-pin
JA
P
= P
+ P
D
Q
L
is the power dissipated in the
L