BU3076HFV-TR Rohm Semiconductor, BU3076HFV-TR Datasheet - Page 19

CLOCK GENERATOR, DIGITAL CAM, HVSOF6

BU3076HFV-TR

Manufacturer Part Number
BU3076HFV-TR
Description
CLOCK GENERATOR, DIGITAL CAM, HVSOF6
Manufacturer
Rohm Semiconductor
Series
-r
Type
Clock Generatorr
Datasheet

Specifications of BU3076HFV-TR

Clock External Input
Yes
Supply Voltage Range
2.85V To 3.6V
Digital Ic Case Style
HVSOF
No. Of Pins
6
Operating Temperature Range
-5°C To +75°C
Svhc
No SVHC (18-Jun-2010)
Package /
RoHS Compliant
Base Number
3076
Rohs Compliant
Yes
Input
Clock
Output
Clock
Frequency - Max
67.5MHz
Voltage - Supply
2.85 V ~ 3.6 V
Operating Temperature
-5°C ~ 75°C
Mounting Type
*
Package / Case
*
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BU3076HFV-TR
Manufacturer:
ROHM/罗姆
Quantity:
20 000
●Cautions on use
(1) Absolute Maximum Ratings
(2) Recommended operating conditions
(3) Reverse connection of power supply connector
(4) Power supply line
(5) GND voltage
(6) Short circuit between terminals and erroneous mounting
(7) Operation in strong electromagnetic field
(8) Inspection with set PCB
(9) Input terminals
(10) Ground wiring pattern
(11) External capacitor
An excess in the absolute maximum ratings, such as applied voltage (VDD or VIN), operating temperature range (Topr),
etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit.
If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take
physical safety measures including the use of fuses, etc.
These conditions represent a range within which characteristics can be provided approximately as expected. The
electrical characteristics are guaranteed under the conditions of each parameter.
The reverse connection of power supply connector can break down ICs. Take protective measures against the
breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s
power supply terminal.
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines.
In this regard, for the digital block power supply and the analog block power supply, even though these power supplies
has the same level of potential, separate the power supply pattern for the digital block from that for the analog block,
thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to
the wiring patterns. For the GND line, give consideration to design the patterns in a similar manner.
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal.
At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the
capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus
determining the constant.
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric
transient.
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting
can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or
between the terminal and the power supply or the GND terminal, the ICs can break down.
Be noted that using ICs in the strong electromagnetic field can malfunction them.
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the
jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In
addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention
to the transportation and the storage of the set PCB.
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of
the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input
terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not
apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power
supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the
guaranteed value of electrical characteristics.
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that
resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of
the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
19/20

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