IC, LATTICEXP2 FPGA, 435MHZ, QFP-208

 

LFXP2-8E-5QN208C

Manufacturer Part NumberLFXP2-8E-5QN208C
DescriptionIC, LATTICEXP2 FPGA, 435MHZ, QFP-208
ManufacturerLATTICE SEMICONDUCTOR
SeriesLatticeXP2
LFXP2-8E-5QN208C datasheets

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Specifications of LFXP2-8E-5QN208C

No. Of Logic Blocks8000No. Of Macrocells4000
Family TypeLatticeXP2No. Of Speed Grades5
No. Of I/o's146Clock ManagementPLL
Total Ram Bits221KbitLead Free Status / RoHS StatusLead free / RoHS Compliant
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April 2008
Absolute Maximum Ratings
Supply Voltage V
. . . . . . . . . . . . . . . . . . . -0.5 to 1.32V
CC
Supply Voltage V
. . . . . . . . . . . . . . . . -0.5 to 3.75V
CCAUX
Supply Voltage V
. . . . . . . . . . . . . . . . . . -0.5 to 3.75V
CCJ
4
Supply Voltage V
. . . . . . . . . . . . . . . . -0.5 to 3.75V
CCPLL
Output Supply Voltage V
. . . . . . . . . . . -0.5 to 3.75V
CCIO
Input or I/O Tristate Voltage Applied
Storage Temperature (Ambient) . . . . . . . . . -65 to 150°C
Junction Temperature Under Bias (Tj) . . . . . . . . . +125°C
1. Stress above those listed under the “Absolute Maximum Ratings” may cause permanent damage to the device. Functional operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
2. Compliance with the Lattice Thermal Management document is required.
3. All voltages referenced to GND.
4. V
only available on csBGA, PQFP and TQFP packages.
CCPLL
5. Overshoot and undershoot of -2V to (V
Recommended Operating Conditions
Symbol
V
Core Supply Voltage
CC
4
V
Auxiliary Supply Voltage
CCAUX
1
V
PLL Supply Voltage
CCPLL
2, 3, 4
V
I/O Driver Supply Voltage
CCIO
2
V
Supply Voltage for IEEE 1149.1 Test Access Port
CCJ
t
Junction Temperature, Commercial Operation
JCOM
t
Junction Temperature, Industrial Operation
JIND
1. V
only available on csBGA, PQFP and TQFP packages.
CCPLL
2. If V
or V
is set to 1.2V, they must be connected to the same power supply as V
CCIO
CCJ
nected to the same power supply as V
3. See recommended voltages by I/O standard in subsequent table.
4. To ensure proper I/O behavior, V
CCIO
On-Chip Flash Memory Specifications
Symbol
Flash Programming Cycles per t
N
PROGCYC
Flash Functional Programming Cycles
t
Data Retention
RETENTION
© 2008 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand
or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
www.latticesemi.com
LatticeXP2 Family Data Sheet
DC and Switching Characteristics
1, 2, 3
5
. . . . . . -0.5 to 3.75V
+ 2) volts is permitted for a duration of <20ns.
IHMAX
Parameter
.
CCAUX
must be turned off at the same time or earlier than V
Parameter
RETENTION
3-1
Preliminary Data Sheet DS1009
Min.
Max.
1.14
1.26
3.135
3.465
3.135
3.465
1.14
3.465
1.14
3.465
0
85
-40
100
If V
or V
is set to 3.3V, they must be con-
CC.
CCIO
CCJ
CCAUX.
Max.
10,000
100,000
20
DS1009
DC and Switching_01.4
Units
V
V
V
V
V
°C
°C
Units
Cycles
Years