HEF4001BP NXP Semiconductors, HEF4001BP Datasheet
HEF4001BP
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HEF4001BP Summary of contents
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... and 15 V parametric ratings I Standardized symmetrical output characteristics I Inputs and outputs are protected against electrostatic effects I Operates across the automotive temperature range from +125 C 3. Ordering information Table 1. Ordering information Type Package number Temperature range HEF4001BP +125 C HEF4001BT +125 C HEF4001BU +125 C 4. Functional diagram ...
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... NXP Semiconductors 5. Pinning information 5.1 Pinning Fig 3. Pin configuration 5.2 Pin description Table 2. Pin description [1] Symbol Pin 10 [1] ‘n’ variable that represents the gates Functional description [1][2] Table 3. Function table Input [1] ‘n’ variable that represents the gates [ HIGH voltage level; ...
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... NXP Semiconductors 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to V Symbol Parameter V supply voltage DD V input voltage I I input/output current I/O T storage temperature stg T ambient temperature amb P total power dissipation tot ...
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... NXP Semiconductors Table 5. Static characteristics unless otherwise specified Symbol Parameter Conditions I HIGH-level output current input leakage I current C input I capacitance 9. Dynamic characteristics Table 6. Dynamic characteristics pF amb Symbol Parameter t HIGH to LOW propagation delay PHL t LOW to HIGH propagation delay PLH t HIGH to LOW output transition time ...
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... NXP Semiconductors 10. Waveforms Measurement points 0.5V M Logic levels: V and V are typical output voltage levels that occur with the output load Fig 4. Propagation delay, output transition time Test data is given in Table 8. Definitions for test circuit: DUT = Device Under Test C = load capacitance including jig and probe capacitance. ...
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... NXP Semiconductors 11. Package outline DIP14: plastic dual in-line package; 14 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. mm 4.2 0.51 3.2 inches 0.17 0.02 0.13 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. ...
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... NXP Semiconductors SO14: plastic small outline package; 14 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.01 0.069 0.004 0.049 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Temperature range maximum increased from 125 C throughout the data sheet. ...
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... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...
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... NXP Semiconductors 16. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 1 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 Functional description . . . . . . . . . . . . . . . . . . . 2 7 Limiting values Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 4 10 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 11 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8 13 Legal information Data sheet status ...