S29GL256P10TFI010 Spansion Inc., S29GL256P10TFI010 Datasheet - Page 65

IC, FLASH, 256MBIT, 100NS, TSOP-56

S29GL256P10TFI010

Manufacturer Part Number
S29GL256P10TFI010
Description
IC, FLASH, 256MBIT, 100NS, TSOP-56
Manufacturer
Spansion Inc.

Specifications of S29GL256P10TFI010

Memory Type
Flash
Memory Size
256Mbit
Memory Configuration
32M X 8 / 16M X 16
Ic Interface Type
CFI, Parallel
Access Time
100ns
Supply Voltage Range
2.7 To 3.6 V
Memory Case Style
TSOP
Data Bus Width
8 bit, 16 bit
Architecture
Uniform
Interface Type
Page-mode
Supply Voltage (max)
3.6 V
Supply Voltage (min)
2.7 V
Maximum Operating Current
50 mA
Mounting Style
SMD/SMT
Operating Temperature
+ 85 C
Package / Case
TSOP-56
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

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Notes
1.
2. PA = program address, SA = sector address, PD = program data.
3. DQ7# is the complement of the data written to the device. D
4. Waveforms are for the word mode.
November 8, 2007 S29GL-P_00_A7
Figure 11.15
Addresses
RESET#
RY/BY#
indicates last two bus cycles of a program or erase operation.
WE#
Data
OE#
CE#
t
RH
555 for program
2AA for erase
D a t a
Figure 11.15 Alternate CE# Controlled Write (Erase/Program) Operation Timings
t
t
t
WS
WC
WH
S h e e t
A0 for program
55 for erase
t
GHEL
t
t
t
DS
CP
PA for program
SA for sector erase
555 for chip erase
CPH
t
AS
t
S29GL-P MirrorBit
DH
OUT
( P r e l i m i n a r y )
is the data written to the device.
t
AH
PD for program
30 for sector erase
10 for chip erase
t
BUSY
®
t
Flash Family
WHWH1 or 2
Data# Polling
DQ7#
PA
D
OUT
65

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