S25FL016K0XMFI041 Spansion Inc., S25FL016K0XMFI041 Datasheet - Page 46

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S25FL016K0XMFI041

Manufacturer Part Number
S25FL016K0XMFI041
Description
MEMORY, FLASH, 16M, 3V, SPI, 8SOIC
Manufacturer
Spansion Inc.
Datasheet

Specifications of S25FL016K0XMFI041

Memory Size
16Mbit
Clock Frequency
104MHz
Supply Voltage Range
2.7V To 3.6V
Memory Case Style
SO
No. Of Pins
8
Operating Temperature Range
-40°C To +85°C
Interface
SPI
Memory Type
RoHS Compliant
Memory Configuration
8K X 256 Bytes
Interface Type
SPI
Rohs Compliant
Yes
7.26
46
Release from Deep Power-down / Device ID (ABh)
The Release from Deep Power-down / Device ID instruction is a multi-purpose instruction. It can be used to
release the device from the deep power-down state, or obtain the devices electronic identification (ID)
number.
To release the device from the deep power-down state, the instruction is issued by driving the CS# pin low,
shifting the instruction code “ABh” and driving CS# high as shown in
down will take the time duration of t
will resume normal operation and other instructions are accepted. The CS# pin must remain high during the
t
When used only to obtain the Device ID while not in the deep power-down state, the instruction is initiated by
driving the CS# pin low and shifting the instruction code “ABh” followed by 3-dummy bytes. The Device ID bits
are then shifted out on the falling edge of CLK with most significant bit (MSB) first. The Device ID values for
the S25FL016K is listed in Manufacturer and Device Identification table. The Device ID can be read
continuously. The instruction is completed by driving CS# high.
When used to release the device from the deep power-down state and obtain the Device ID, the instruction is
the same as previously described, and shown in
remain high for a time duration of t
other instructions will be accepted. If the Release from Deep Power-down / Device ID instruction is issued
while an Erase, Program or Write cycle is in process (when BUSY equals 1) the instruction is ignored and will
not have any effects on the current cycle.
RES1
CLK
CS#
SO
SI
= MSB
time duration.
Mode 3
Mode 0
CLK
CS#
SO
SI
Figure 7.30 Release from Deep Power-down / Device ID Instruction Sequence Diagram
Mode 3
Mode 0
0
1
Figure 7.29 Release from Deep Power-down Instruction Sequence
Instruction (ABh)
2
0
High Impedance
3
4
1
Instruction (ABh)
5
2
D a t a
High Impedance
6
RES2
3
RES1
7 8
23 22 21
4
. After this time duration the device will resume normal operation and
S25FL016K
(See AC Electrical Characteristics on page
S h e e t
9
5
3 Dummy Bytes
10
6
Figure
7
28 29 30 31 32 33 34 35 36 37 38
3
( P r e l i m i n a r y )
2
7.30, except that after CS# is driven high it must
Deep Power-down Current
1
0
7
t
RES1
6
Device ID
Figure
5
S25FL016K_00_02 September 8, 2010
4
Deep Power-down Current
7.29. Release from deep power-
3
2
1
59.) before the device
Stand-by Current
0
Mode 3
Mode 0
Mode 3
Mode 0
t
RES2
Stand-by Current

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