ISPLSI2032E-110LJ44 LATTICE SEMICONDUCTOR, ISPLSI2032E-110LJ44 Datasheet

CMOS ISP EEPLD, SMD, 2032, PLCC44

ISPLSI2032E-110LJ44

Manufacturer Part Number
ISPLSI2032E-110LJ44
Description
CMOS ISP EEPLD, SMD, 2032, PLCC44
Manufacturer
LATTICE SEMICONDUCTOR
Datasheet

Specifications of ISPLSI2032E-110LJ44

No. Of Macrocells
32
No. Of I/o's
34
Propagation Delay
10ns
Global Clock Setup Time
7.5ns
Frequency
110MHz
Supply Voltage Range
4.75V To 5.25V
Operating Temperature Range
0°C To +70°C

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Copyright © 2002 Lattice Semiconductor Corp. All brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject
to change without notice.
LATTICE SEMICONDUCTOR CORP., 5555 Northeast Moore Ct., Hillsboro, Oregon 97124, U.S.A.
Tel. (503) 268-8000; 1-800-LATTICE; FAX (503) 268-8556; http://www.latticesemi.com
2032e_04
• SuperFAST HIGH DENSITY IN-SYSTEM
• HIGH PERFORMANCE E
• ispLSI OFFERS THE FOLLOWING ADDED FEATURES
• OFFERS THE EASE OF USE AND FAST SYSTEM
Features
PROGRAMMABLE LOGIC
— 1000 PLD Gates
— 32 I/O Pins, Two Dedicated Inputs
— 32 Registers
— High Speed Global Interconnect
— Wide Input Gating for Fast Counters, State
— Small Logic Block Size for Random Logic
— 100% Functionally and JEDEC Upward Compatible
— TTL Compatible Inputs and Outputs
— 5V Programmable Logic Core
— ispJTAG™ In-System Programmable via IEEE 1149.1
— User-Selectable 3.3V or 5V I/O (48-Pin Package Only)
— PCI Compatible Outputs (48-Pin Package Only)
— Open-Drain Output Option
— Electrically Erasable and Reprogrammable
— Non-Volatile
— Unused Product Term Shutdown Saves Power
— Increased Manufacturing Yields, Reduced Time-to-
— Reprogram Soldered Devices for Faster Prototyping
SPEED OF PLDs WITH THE DENSITY AND FLEXIBILITY
OF FIELD PROGRAMMABLE GATE ARRAYS
— Complete Programmable Device Can Combine Glue
— Enhanced Pin Locking Capability
— Three Dedicated Clock Input Pins
— Synchronous and Asynchronous Clocks
— Programmable Output Slew Rate Control to
— Flexible Pin Placement
— Optimized Global Routing Pool Provides Global
Machines, Address Decoders, etc.
with ispLSI 2032 Devices
f
t
(JTAG) Test Access Port
Supports Mixed Voltage Systems
Market and Improved Product Quality
Logic and Structured Designs
Minimize Switching Noise
Interconnectivity
max = 225 MHz Maximum Operating Frequency
pd = 3.5 ns Propagation Delay
2
CMOS
®
TECHNOLOGY
1
The ispLSI 2032E is a High Density Programmable Logic
Device. The device contains 32 Registers, 32 Universal
I/O pins, two Dedicated Input Pins, three Dedicated
Clock Input Pins, one dedicated Global OE input pin and
a Global Routing Pool (GRP). The GRP provides com-
plete interconnectivity between all of these elements.
The ispLSI 2032E features 5V in-system programmabil-
ity and in-system diagnostic capabilities. The ispLSI
2032E offers non-volatile reprogrammability of the logic,
as well as the interconnect to provide truly reconfigurable
systems.
The basic unit of logic on the ispLSI 2032E device is the
Generic Logic Block (GLB). The GLBs are labeled A0, A1
.. A7 (see Figure 1). There are a total of eight GLBs in the
ispLSI 2032E device. Each GLB is made up of four
macrocells. Each GLB has 18 inputs, a programmable
AND/OR/Exclusive OR array, and four outputs which can
be configured to be either combinatorial or registered.
Inputs to the GLB come from the GRP and dedicated
inputs. All of the GLB outputs are brought back into the
GRP so that they can be connected to the inputs of any
GLB on the device.
The device also has 32 I/O cells, each of which is directly
connected to an I/O pin. Each I/O cell can be individually
Functional Block Diagram
Description
A1
A2
A3
A0
SuperFAST™ High Density PLD
GLB
ispLSI
Global Routing Pool
Logic
Array
In-System Programmable
(GRP)
D Q
D Q
D Q
D Q
®
2032E
January 2002
A6
A5
A4
A7
0139Bisp/2000

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ISPLSI2032E-110LJ44 Summary of contents

Page 1

... Optimized Global Routing Pool Provides Global Interconnectivity Copyright © 2002 Lattice Semiconductor Corp. All brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. LATTICE SEMICONDUCTOR CORP., 5555 Northeast Moore Ct., Hillsboro, Oregon 97124, U.S.A. ...

Page 2

Functional Block Diagram Figure 1. ispLSI 2032E Functional Block Diagram GOE 0 I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 I/O 8 I/O 9 I/O 10 I/O 11 I/O 12 I/O 13 ...

Page 3

Absolute Maximum Ratings Supply Voltage V .................................. -0.5 to +7.0V cc Input Voltage Applied ........................ -2 Off-State Output Voltage Applied ..... -2 Storage Temperature ................................ -65 to 150°C Case Temp. with Power Applied .............. -55 to ...

Page 4

... Available in 48-pin package only. 6. Maximum I varies widely with specific device configuration and operating frequency. Refer to the CC Power Consumption section of this data sheet and the Thermal Management section of the Lattice Semiconductor Data Book or CD-ROM to estimate maximum I Specifications ispLSI 2032E Figure 2. Test Load GND to 3 ...

Page 5

External Timing Parameters TEST 2 PARAMETER # 4 COND Data Prop. Delay, 4PT Bypass, ORP Bypass pd1 Data Prop. Delay pd2 f max A 3 Clk Frequency with Int. Feedback f – 4 Clk ...

Page 6

External Timing Parameters TEST 2 PARAMETER # 4 COND Data Propagation Delay, 4PT Bypass, ORP Bypass pd1 Data Propagation Delay pd2 Clock Frequency with Internal Feedback max f – 4 Clock ...

Page 7

Internal Timing Parameters 2 PARAMETER # Inputs t 20 Input Buffer Delay Dedicated Input Delay din GRP t 22 GRP Delay grp GLB Product Term Bypass Path Delay (Combinatorial) 4ptbpc Product ...

Page 8

Internal Timing Parameters 2 PARAMETER # Inputs t 20 Input Buffer Delay Dedicated Input Delay din GRP t 22 GRP Delay grp GLB Product Term Bypass Path Delay (Combinatorial) 4ptbpc Product ...

Page 9

Timing Model I/O Cell Ded. In #21 I/O Delay I/O Pin #20 (Input) #45 Reset #43, 44 Y0,1,2 GOE Derivations of su, h and co from the Product Term Clock Logic ...

Page 10

Power Consumption Power consumption in the ispLSI 2032E device depends on two primary factors: the speed at which the device is operating and the number of Product Terms used. Figure 3. Typical Device Power Consumption vs fmax 150 140 130 ...

Page 11

Pin Description 44-PIN PLCC PIN NUMBERS NAME I I/O 3 15, 16, 17, 18, I I/O 7 19, 20, 21, 22, I I/O 11 25, 26, 27, 28, I I/O 15 29, ...

Page 12

Pin Configuration ispLSI 2032E 44-Pin PLCC Pinout Diagram I/O 28 I/O 29 I VCC BSCAN 1 TDI/IN 0 I/O 0 I Pins have dual function capability pins are not to ...

Page 13

Pin Configuration ispLSI 2032E 48-Pin TQFP Pinout Diagram I/O 28 I/O 29 I VCC BSCAN 1 TDI/IN 0 I/O 0 I/O 1 I/O 2 GND 1. Pins have dual function capability pins are not ...

Page 14

Part Number Description ispLSI 2032E Device Family Device Number Speed f 225 = 225 MHz max f 200 = 200 MHz max f 180 = 180 MHz max f 135 = 135 MHz max f 110 = 110 MHz max ...

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