LMC555CMX National Semiconductor, LMC555CMX Datasheet
LMC555CMX
Specifications of LMC555CMX
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LMC555CMX Summary of contents
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... Pulse Width Modulator Ordering Information Package Temperature Range Industrial −40˚C to +85˚C 8-Pin Small Outline (SO) LMC555CM LMC555CMX 8-Pin Mini Small Outline LMC555CMM (MSOP) LMC555CMMX 8-Pin Molded Dip (MDIP) LMC555CN 8-Bump micro SMD LMC555CBP LMC555CBPX ...
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Connection Diagrams www.national.com 8-Pin SOIC, MSOP, MDIP Top View 8-Bump micro SMD Top View (Bump Side Down) 2 00866901 00866909 ...
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... Absolute Maximum Ratings If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. + Supply Voltage, V Input Voltages TRIG RES CTRL V THRESH Output Voltages DIS Output Current DIS Storage Temperature Range Soldering Information MDIP Soldering (10 seconds) ...
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Electrical Characteristics Test Circuit 25˚C, all switches open, RESET to V Symbol Parameter ∆t/∆T Timing Shift with Temperature f Astable Frequency A f Maximum Frequency MAX Output Rise and R F Fall Times t Trigger ...
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Application Information MONOSTABLE OPERATION In this mode of operation, the timer functions as a one-shot (Figure 1). The external capacitor is initially held discharged by internal circuitry. Upon application of a negative trigger pulse of less than 1 ...
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Application Information Top Trace: Output 5 V/Div. CC TIME = 20 µs/Div. Bottom Trace: Capacitor Voltage 1 V/Div 3.9 kΩ kΩ 0.01 µF FIGURE 5. Astable Waveforms The ...
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Application Information Top Trace: Modulation 1 V/Div. CC TIME = 0.2 ms/Div. Bottom Trace: Output Voltage 2 V/Div 9.1 kΩ 0.01 µF FIGURE 9. Pulse Width Modulator Waveforms PULSE POSITION MODULATOR This ...
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Physical Dimensions 8-Pin (0.118” Wide) Molded Mini Small Outline Package www.national.com inches (millimeters) unless otherwise noted Molded Small Outline (SO) Package (M) NS Package Number M08A NS Package Number MUA08A 8 ...
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Physical Dimensions inches (millimeters) unless otherwise noted (Continued) Molded Dual-in-line Package (N) NS Package Number N08E 9 www.national.com ...
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Physical Dimensions NOTES: UNLESS OTHERWISE SPECIFIED 1. EPOXY COATING 2. 63Sn/37Pb EUTECTIC BUMP 3. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD. 4. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION. REMAINING PINS ARE NUMBERED COUNTERCLOCKWISE. 5. ...
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... NOTES: UNLESS OTHERWISE SPECIFIED 1. EPOXY COATING 2. FOR SOLDER BUMP COMPOSITION, SEE “SOLDER INFORMATION” IN THE PACKAGING SECTION OF THE NATIONAL SEMICONDUCTOR WEB PAGE (www.national.com). 3. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD. 4. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION. ...
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Tel: 81-3-5639-7560 ...