PIC16F54T-I/SO Microchip Technology, PIC16F54T-I/SO Datasheet - Page 79

• Manufacturer Part Number: PIC16F54T-I/SO
• Description: IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,SOP,18PIN,PLASTIC
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F54T-I/SO

• Rohs Compliant: YES
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Peripherals: POR, WDT
• Number Of I /o: 12
• Program Memory Size: 768B (512 x 12)
• Program Memory Type: FLASH
• Ram Size: 25 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 18-SOIC (7.5mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Connectivity: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

© 2007 Microchip Technology Inc.
28-Lead Plastic Shrink Small Outline (SS) – 5.30 mm Body [SSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.20 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
A
A1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Lead Thickness
Foot Angle
Lead Width
N
1 2
b
D
Dimension Limits
e
E1
Units
A2
A1
E1
L1
N
D
A
E
e
L
c
φ
b
A2
E
1.65
0.05
7.40
5.00
9.90
0.55
0.09
0.22
MIN
c
0°
–
MILLIMETERS
L1
0.65 BSC
1.25 REF
10.20
NOM
7.80
1.75
5.30
0.75
28
4°
–
–
–
–
Microchip Technology Drawing C04-073B
10.50
MAX
2.00
1.85
8.20
5.60
0.95
0.25
0.38
PIC16F5X
8°
–
DS41213D-page 77
φ
L