SPC5604PGF0MLL6 Freescale Semiconductor, SPC5604PGF0MLL6 Datasheet - Page 45

• Manufacturer Part Number: SPC5604PGF0MLL6
• Description: IC MCU 32BIT 512KB FLASH 100LQFP
• Manufacturer: Freescale Semiconductor
• Series: MPC56xx Qorivvar

Specifications of SPC5604PGF0MLL6

• Core Processor: e200z0h
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: CAN, FlexRay, LIN, SPI, UART/USART
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 68
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 64K x 8
• Ram Size: 40K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 30x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 100-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

3.5
3.5.1
Freescale Semiconductor
Thermal characteristics
1
2
3
4
Symbol
R
Package thermal characteristics
Junction-to-ambient thermal resistance determined per JEDEC JESD51-7. Thermal test board
meets JEDEC specification for this package.
Junction-to-board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets
JEDEC specification for the specified package.
Junction-to-case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold
plate temperature is used for the case temperature. Reported value includes the thermal resistance
of the interface layer.
Thermal characterization parameter indicating the temperature difference between the board and the
junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal
characterization parameter is written as Psi-JB.
R
R
JCtop


JB
JA
JB
JC
Thermal resistance junction-to-ambient,
natural convection
Thermal resistance junction-to-board
Thermal resistance junction-to-case (top)
Junction-to-board, natural convection
Junction-to-case, natural convection
Figure 7. Independent ADC supply (3.0 V 
5.5 V
3.0 V
Table 10. Thermal characteristics for 144-pin LQFP
VDD_HV_ADCx
MPC5604P Microcontroller Data Sheet, Rev. 7
Parameter
1
5
2
4
3.0 V
3
Single layer board—1s
Four layer board—2s2p
Four layer board—2s2p
Single layer board—1s
Operating conditions
Operating conditions
Conditions
V
DD_HV_REG
5.5 V
 5.5 V)
Typical value Unit
VDD_HV_REG
54.2
44.4
29.9
30.2
9.3
0.8
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
45