SPC5604PEF0MLQ6 Freescale Semiconductor, SPC5604PEF0MLQ6 Datasheet - Page 46

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SPC5604PEF0MLQ6

Manufacturer Part Number
SPC5604PEF0MLQ6
Description
IC MCU 32BIT 512KB FLASH 144LQFP
Manufacturer
Freescale Semiconductor
Series
MPC56xx Qorivvar
Datasheet

Specifications of SPC5604PEF0MLQ6

Core Processor
e200z0h
Core Size
32-Bit
Speed
64MHz
Connectivity
CAN, FlexRay, LIN, SPI, UART/USART
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
108
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Eeprom Size
64K x 8
Ram Size
40K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 30x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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3.5.2
An estimation of the chip junction temperature, T
The junction to ambient thermal resistance is an industry standard value that provides a quick and easy estimation of thermal
performance. Unfortunately, there are two values in common usage: the value determined on a single layer board and the value
obtained on a board with two planes. For packages such as the PBGA, these values can be different by a factor of two. Which
value is closer to the application depends on the power dissipated by other components on the board. The value obtained on a
single layer board is appropriate for the tightly packed printed circuit board. The value obtained on the board with the internal
planes is usually appropriate if the board has low power dissipation and the components are well separated.
When a heat sink is used, the thermal resistance is expressed in
and a case to ambient thermal resistance:
46
where:
T
R
P
where:
A
D
JA
5
1
2
3
4
5
Symbol
R
General notes for specifications at maximum junction temperature
Thermal characterization parameter indicating the temperature difference between the case and the
junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal
characterization parameter is written as Psi-JC.
Junction-to-ambient thermal resistance determined per JEDEC JESD51-7. Thermal test board
meets JEDEC specification for this package.
Junction-to-board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets
JEDEC specification for the specified package.
Junction-to-case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold
plate temperature is used for the case temperature. Reported value includes the thermal resistance
of the interface layer.
Thermal characterization parameter indicating the temperature difference between the board and the
junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal
characterization parameter is written as Psi-JB.
Thermal characterization parameter indicating the temperature difference between the case and the
junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal
characterization parameter is written as Psi-JC.
R
R
JCtop
JA
JB
JC
JB
= ambient temperature for the package (°C)
= junction to ambient thermal resistance (°C/W)
= power dissipation in the package (W)
Thermal resistance junction-to-ambient,
natural convection
Thermal resistance junction-to-board
Thermal resistance junction-to-case (top)
Junction-to-board, natural convection
Junction-to-case, natural convection
Table 11. Thermal characteristics for 100-pin LQFP
MPC5604P Microcontroller Data Sheet, Rev. 7
Parameter
1
T
R
J
J
JA
, can be obtained from
= T
= R
A
+ (R
JC
5
2
4
JA
+ R
Equation 2
3
* P
CA
Single layer board—1s
Four layer board—2s2p
Four layer board—2s2p
Single layer board—1s
Operating conditions
Operating conditions
D
)
Conditions
Equation
as the sum of a junction to case thermal resistance
1:
Typical value Unit
47.3
35.3
19.1
19.1
9.7
0.8
Freescale Semiconductor
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Eqn. 1
Eqn. 2

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