B57550G 104F EPCOS Inc, B57550G 104F Datasheet
B57550G 104F
Specifications of B57550G 104F
Related parts for B57550G 104F
B57550G 104F Summary of contents
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... NTC thermistors for temperature measurement Glass-encapsulated sensors, standard type Series/Type: B57550G, B57550G1 Date: February 2009 © EPCOS AG 2009. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited. ...
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... Temperature measurement Glass-encapsulated sensors Applications Temperature measurement Features Glass-encapsulated, heat-resistive and highly stable For temperature measurement up to 300 C Very short response time Small dimensions Leads: dumet wires (copper-clad FeNi) Options Leads: nickel-plated dumet wires Alternative dimensions available on request Delivery mode Bulk ...
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... Temperature measurement Glass-encapsulated sensors Electrical specification and ordering codes R No. of R/T 25 characteristic 2 k 8401 2 k 8401 5 k 8402 5 k 8402 10 k 7003 10 k 7003 10 k 8307 10 k 8307 20 k 8415 20 k 8415 30 k 7002 30 k 7002 50 k 8403 50 k 8403 100 k ...
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... Please read Cautions and warnings and Important notes at the end of this document. Test conditions Storage at upper category temperature T: 300 C t: 1000 h Temperature of air Relative humidity of air: 85% Duration: 56 days Lower test temperature Upper test temperature: 200 C Number of cycles: 1000 Page B57550G, B57550G1 ...
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... Temperature measurement Glass-encapsulated sensors R/T characteristics 7002 R/T No 3988 K 25/100 R /R (%/ 55.0 96.33 7.4 50.0 66.866 7.2 45.0 47.037 6.9 40.0 33.508 6.7 35.0 24.156 6.4 30.0 17.613 6.2 25.0 12.98 6.0 20.0 9.6643 5.8 15.0 7.2656 5.6 10.0 5.5129 5.4 5 ...
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... Temperature measurement Glass-encapsulated sensors 7002 R/T No 3988 K 25/100 R /R (%/ 160.0 0.014679 2.2 165.0 0.013149 2.2 170.0 0.011806 2.1 175.0 0.010623 2.1 180.0 0.0095804 2.0 185.0 0.0086582 2.0 190.0 0.0078408 2.0 195.0 0.0071148 1.9 200.0 0.0064685 1.9 205.0 0.005892 1.8 210.0 0.0053767 1 ...
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... Temperature measurement Glass-encapsulated sensors R/T characteristics 8307 R/T No 3492 K 25/100 R /R (%/ 55.0 52.624 6.4 50.0 38.452 6.2 45.0 28.401 6.0 40.0 21.194 5.8 35.0 15.972 5.6 30.0 12.149 5.4 25.0 9.3246 5.2 20.0 7.2181 5.0 15.0 5.6332 4.9 10.0 4.4308 4.7 5 ...
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... Temperature measurement Glass-encapsulated sensors 8307 R/T No 3492 K 25/100 R /R (%/ 160.0 0.024694 2.0 165.0 0.022414 1.9 170.0 0.020385 1.9 175.0 0.018577 1.8 180.0 0.016961 1.8 185.0 0.015514 1.8 190.0 0.014216 1.7 195.0 0.013049 1.7 200.0 0.011999 1.7 205.0 0.011051 1.6 210.0 0.010194 1 ...
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... Temperature measurement Glass-encapsulated sensors R/T characteristics 8403 R/T No 3970 K 0/100 R /R (%/ 55.0 103.29 7.6 50.0 71.079 7.3 45.0 49.619 7.1 40.0 35.108 6.8 35.0 25.158 6.5 30.0 18.245 6.3 25.0 13.383 6.1 20.0 9.9221 5.9 15.0 7.4316 5.7 10.0 5.6202 5.5 5 ...
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... Temperature measurement Glass-encapsulated sensors 8403 R/T No 3970 K 0/100 R /R (%/ 160.0 0.014473 2.2 165.0 0.012962 2.2 170.0 0.011636 2.1 175.0 0.010469 2.1 180.0 0.0094395 2.0 185.0 0.0085294 2.0 190.0 0.0077229 2.0 195.0 0.0070067 1.9 200.0 0.0063691 1.9 205.0 0.0058005 1.9 210.0 0.0052924 1 ...
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... Temperature measurement Glass-encapsulated sensors R/T characteristics R/T No. 8415 3970 K 0/100 R /R (%/ 55.0 103.29 7.6 50.0 71.079 7.3 45.0 49.619 7.1 40.0 35.108 6.8 35.0 25.158 6.5 30.0 18.245 6.3 25.0 13.383 6.1 20.0 9.9221 5.9 15.0 7.4316 5.7 10.0 5.6202 5.5 5 ...
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... Leadless NTC thermistors In case of NTC thermistors without leads, soldering is restricted to devices which are provided with a solderable metallization. The temperature shock caused by the application of hot solder may produce fine cracks in the ceramic, resulting in changes in resistance. To prevent leaching of the metallization, solder with silver additives or with a low tin content should be used ...
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... When thermistors are sealed, potted or overmolded, there must be no mechanical stress caused by thermal expansion during the production process (curing / overmolding process) and during later operation. The upper category temperature of the thermistor must not be exceeded. Ensure that the materials used (sealing / potting compound and plastic material) are chemically neutral. ...
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... Glass-encapsulated sensors The components should be left in the original packing. Touching the metallization of unsoldered thermistors may change their soldering properties. Storage temperature: Relative humidity (without condensation): Solder the thermistors listed in this data book after shipment from EPCOS within the time speci- fied: ...
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... See "Important notes" at the end of this document. Storage Store thermistors only in original packaging. Do not open the package prior to storage. Storage conditions in original packaging: storage temperature humidity 75% annual mean, <95% maximum 30 days per annum, dew precipitation is inadmissible. Do not store thermistors where they are exposed to heat or direct sunlight. Otherwise, the packing material may be deformed or components may stick together, causing problems during mounting ...
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... Electrodes/contacts must not be scratched or damaged before/during/after the mounting process. Contacts and housing used for assembly with the thermistor must be clean before mounting. Ensure that adjacent materials are designed for operation at temperatures comparable to the surface temperature of the thermistor. Be sure that surrounding parts and materials can withstand the temperature. ...
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... R /R Resistance tolerance caused spread of B value R Insulation resistance ins R Parallel resistance P R Rated resistance Resistance tolerance Series resistance S R Resistance at temperature T T (e. resistance Temperature T Temperature tolerance t Time T Ambient temperature A T Upper category temperature max T Lower category temperature min T Operating temperature op T ...
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... Temperature measurement Glass-encapsulated sensors Symbol English Temperature coefficient Tolerance, change Dissipation factor th Thermal cooling time constant c Thermal time constant a Abbreviations / Notes Symbol English Surface-mounted devices * To be replaced by a number in ordering codes, type designations etc replaced by a letter. All dimensions are given in mm. ...
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Important notes The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical ...