G4A01216C THERMODISC, G4A01216C Datasheet - Page 13

• Manufacturer Part Number: G4A01216C
• Description: Thermal Fuse
• Manufacturer: THERMODISC
• Series: MICROTEMPr

Specifications of G4A01216C

• Voltage Rating Vac: 250V
• Fuse Current: 10A
• Fuse Terminals: Axial Leaded
• Functioning Temperature: 216°C
• Holding Temperature: 200°C
• Length/height, External: 14.7mm
• Voltage Ac: 250V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Substitute actual thermal cutoffs in a sufficient number of finished products and re-run the
tests to obtain statistical verification of the results. For multiple TCO applications, test functional
thermal cutoffs under fault conditions so that the product overheats and each thermal cutoff is
independently called upon to interrupt the flow of current. Each thermal cutoff should open the
circuit independently of any other over-temperature limit controls, with product damage not
exceeding an acceptable level. This test should be run using the maximum voltage and current;
the thermal cutoff will be expected to interrupt and hold open.
Installation of Thermal Cutoffs
®
The performance of a MICROTEMP
thermal cutoff can be affected by installation methods such
as soldering, welding, splicing, lead bending, insulation, clamping and mounting. Certain precautions
®
should be taken during installation to ensure that the MICROTEMP
thermal cutoff is not damaged,
which may cause it to not operate in its intended manner. Likewise, care should be taken during
installation to ensure that the TCO in every unit experiences the expected temperature range
environment previously determined during the calibration temperature selection. The
following guidelines should be used to minimize undesirable conditions that can result from
improper installation practices.
Soldering Leads
Thermal cutoff leads should be heat sinked during the soldering operation (see figure 7). If
excessive heat is conducted by the leads into the thermal cutoff, it can shorten the life of the TCO.
In addition, excessive lead temperatures can damage the epoxy and possibly result in the TCO
failing to open. More heat sinking is necessary for thermal cutoffs with low temperature ratings.
HEAT SINK HERE
SOLDER
SOLDER
Figure 7
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