MMBZ6V2AL NXP Semiconductors, MMBZ6V2AL Datasheet
MMBZ6V2AL
Specifications of MMBZ6V2AL
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MMBZ6V2AL Summary of contents
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... Unidirectional double ElectroStatic Discharge (ESD) protection diodes in a common anode configuration, encapsulated in a SOT23 (TO-236AB) small Surface-Mounted Device (SMD) plastic package. The devices are designed for ESD and transient overvoltage protection two signal lines. Table 1. Type number MMBZ5V6AL MMBZ6V2AL MMBZ6V8AL MMBZ9V1AL MMBZ10VAL MMBZ12VAL MMBZ15VAL MMBZ18VAL ...
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... Conditions reverse standoff voltage MMBZ5V6AL MMBZ6V2AL MMBZ6V8AL MMBZ9V1AL MMBZ10VAL MMBZ12VAL MMBZ15VAL MMBZ18VAL MMBZ20VAL MMBZ27VAL MMBZ33VAL diode capacitance MHz; V MMBZ5V6AL MMBZ6V2AL MMBZ6V8AL MMBZ9V1AL MMBZ10VAL MMBZ12VAL MMBZ15VAL MMBZ18VAL MMBZ20VAL MMBZ27VAL MMBZ33VAL Pinning Description cathode (diode 1) cathode (diode 2) common anode Rev. 02 — 10 December 2009 ...
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... Type number MMBZ5V6AL MMBZ6V2AL MMBZ6V8AL MMBZ9V1AL MMBZ10VAL MMBZ12VAL MMBZ15VAL MMBZ18VAL MMBZ20VAL MMBZ27VAL MMBZ33VAL 4. Marking Table 5. Type number MMBZ5V6AL MMBZ6V2AL MMBZ6V8AL MMBZ9V1AL MMBZ10VAL MMBZ12VAL MMBZ15VAL MMBZ18VAL MMBZ20VAL MMBZ27VAL MMBZ33VAL [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China MMBZXAL_SER_2 Product data sheet ...
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... MMBZ5V6AL MMBZ6V2AL MMBZ6V8AL MMBZ9V1AL MMBZ10VAL MMBZ12VAL MMBZ15VAL MMBZ18VAL MMBZ20VAL MMBZ27VAL MMBZ33VAL total power dissipation T amb MMBZxAL series MMBZ5V6AL MMBZ6V2AL MMBZ6V8AL MMBZ9V1AL MMBZ10VAL MMBZ12VAL MMBZ15VAL MMBZ18VAL MMBZ20VAL MMBZ27VAL MMBZ33VAL Rev. 02 — 10 December 2009 MMBZxAL series Min = 10/1000 μs [1][ 10/1000 μs [1][2] ...
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... NXP Semiconductors Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol amb T stg In accordance with IEC 61643-321 (10/1000 μs current waveform). [1] [2] Measured from pin pin 3. [3] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint ...
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... NXP Semiconductors 150 I PP (%) ; 10 μs 100 % I 100 1.0 2.0 10/1000 μs pulse waveform according to Fig 1. IEC 61643-321 MMBZXAL_SER_2 Product data sheet Low capacitance unidirectional double ESD protection diodes 006aab319 ; 1000 μs 3.0 4.0 t (ms) p Fig 2. Rev. 02 — 10 December 2009 MMBZxAL series ...
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... MMBZxAL series MMBZ5V6AL MMBZ6V2AL MMBZ6V8AL MMBZ9V1AL MMBZ10VAL MMBZ12VAL MMBZ15VAL MMBZ18VAL MMBZ20VAL MMBZ27VAL MMBZ33VAL thermal resistance from junction to solder point MMBZ5V6AL MMBZ6V2AL MMBZ6V8AL MMBZ9V1AL MMBZ10VAL MMBZ12VAL MMBZ15VAL MMBZ18VAL MMBZ20VAL MMBZ27VAL MMBZ33VAL Rev. 02 — 10 December 2009 MMBZxAL series Conditions Min Typ in free air ...
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... MMBZ33VAL reverse leakage current MMBZ5V6AL V RWM MMBZ6V2AL V RWM MMBZ6V8AL V RWM MMBZ9V1AL V RWM MMBZ10VAL V RWM MMBZ12VAL V RWM MMBZ15VAL V RWM MMBZ18VAL V RWM MMBZ20VAL V RWM MMBZ27VAL V RWM MMBZ33VAL V RWM breakdown voltage MMBZ5V6AL MMBZ6V2AL MMBZ6V8AL MMBZ9V1AL MMBZ10VAL MMBZ12VAL MMBZ15VAL MMBZ18VAL MMBZ20VAL MMBZ27VAL MMBZ33VAL Rev. 02 — 10 December 2009 ...
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... MMBZ33VAL clamping voltage MMBZ5V6AL I PPM MMBZ6V2AL I PPM MMBZ6V8AL I PPM MMBZ9V1AL I PPM MMBZ10VAL I PPM MMBZ12VAL I PPM MMBZ15VAL I PPM MMBZ18VAL I PPM MMBZ20VAL I PPM MMBZ27VAL I PPM MMBZ33VAL I PPM temperature coefficient MMBZ5V6AL MMBZ6V2AL MMBZ6V8AL MMBZ9V1AL MMBZ10VAL MMBZ12VAL MMBZ15VAL MMBZ18VAL MMBZ20VAL MMBZ27VAL MMBZ33VAL Rev. 02 — 10 December 2009 ...
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... NXP Semiconductors PPM ( −2 − °C T amb unidirectional and bidirectional Fig 3. Rated peak pulse power as a function of exponential pulse duration (rectangular waveform); typical values 250 C d (pF) 200 150 (1) 100 ( ° MHz; T amb (1) MMBZ5V6AL: unidirectional (2) MMBZ5V6AL: bidirectional (3) MMBZ6V8AL: unidirectional (4) MMBZ6V8AL: bidirectional Fig 5. ...
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... NXP Semiconductors (1) MMBZ5V6AL RWM (2) MMBZ6V8AL 4.5 V RWM (3) MMBZ9V1AL RWM (4) MMBZ27VAL RWM Fig 7. Reverse leakage current as a function of ambient temperature; typical values −V −V − RWM − + P-N Fig 8. V-I characteristics for a unidirectional ESD protection diode MMBZXAL_SER_2 Product data sheet Low capacitance unidirectional double ESD protection diodes ...
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... ESD and surge pulses. The devices may be used on lines where the signal polarities are either positive or negative with respect to ground. The MMBZ5V6AL, MMBZ6V2AL, MMBZ6V8AL, MMBZ9V1AL and MMBZ10VAL provide a surge capability per line, the MMBZ12VAL, MMBZ15VAL, MMBZ18VAL, MMBZ20VAL, MMBZ27VAL and MMBZ33VAL provide a surge capability per line, for a 10/1000 μ ...
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... NXP Semiconductors 10. Package outline Fig 11. Package outline SOT23 (TO-236AB) 11. Packing information Table 11. The indicated -xxx are the last three digits of the 12NC ordering code. Type number MMBZ5V6AL MMBZ6V2AL MMBZ6V8AL MMBZ9V1AL MMBZ10VAL MMBZ12VAL MMBZ15VAL MMBZ18VAL MMBZ20VAL MMBZ27VAL MMBZ33VAL [1] For further information and the availability of packing methods, see ...
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... NXP Semiconductors 12. Soldering 3 1.7 Fig 12. Reflow soldering footprint SOT23 (TO-236AB) 2.6 4.6 Fig 13. Wave soldering footprint SOT23 (TO-236AB) MMBZXAL_SER_2 Product data sheet Low capacitance unidirectional double ESD protection diodes 3.3 2.9 1.9 0.7 (3×) 0.5 (3×) 0.6 (3×) 1 2.2 1.2 (2×) 1.4 (2× ...
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... NXP Semiconductors 13. Revision history Table 12. Revision history Document ID Release date MMBZXAL_SER_2 20091210 • Modifications: Type numbers MMBZ5V6AL, MMBZ6V2AL, MMBZ6V8AL, MMBZ9V1AL and MMBZ10VAL added • Type numbers MMBZ12VAL/DG, MMBZ15VAL/DG, MMBZ18VAL/DG, MMBZ20VAL/DG, MMBZ27VAL/DG, MMBZ33VAL/DG removed • Figure 5 • Figure • Figure • Section 14 “Legal ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 16. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 2 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 7 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 8 8 Application information Test information . . . . . . . . . . . . . . . . . . . . . . . . 12 9.1 Quality information . . . . . . . . . . . . . . . . . . . . . 12 10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13 11 Packing information ...