SKM150GB12V
SEMITRANS
®
2
SKM150GB12V
Features
• V-IGBT = 6. Generation Trench V-IGBT
(Fuji)
• CAL4 = Soft switching 4. Generation
CAL-diode
• Isolated copper baseplate using DBC
technology (Direct Copper Bonding)
• UL recognized, file no. E63532
• Increased power cycling capability
• With integrated gate resistor
• Low switching losses at high di/dt
Typical Applications*
• AC inverter drives
• UPS
• Electronic welders
Remarks
• Case temperature limited to
T
= 125°C max, recomm.
c
T
= -40 ... +150°C, product
op
rel. results valid for T
= 150°
j
GB
© by SEMIKRON
Absolute Maximum Ratings
Symbol
Conditions
IGBT
V
T
= 25 °C
j
CES
T
= 25 °C
I
C
c
T
= 175 °C
j
T
= 80 °C
c
I
Cnom
I
I
= 3xI
CRM
CRM
Cnom
V
GES
V
= 720 V
CC
V
≤ 20 V
T
= 125 °C
t
psc
GE
j
V
≤ 1200 V
CES
T
j
Inverse diode
I
T
= 25 °C
F
c
T
= 175 °C
j
T
= 80 °C
c
I
Fnom
I
I
= 3xI
FRM
FRM
Fnom
I
t
= 10 ms, sin 180°, T
= 25 °C
p
j
FSM
T
j
Module
T
= 80 °C
I
terminal
t(RMS)
T
stg
V
AC sinus 50Hz, t = 1 min
isol
Characteristics
Symbol
Conditions
IGBT
I
= 150 A
T
= 25 °C
V
C
CE(sat)
j
V
= 15 V
GE
T
= 150 °C
chiplevel
j
V
T
= 25 °C
j
CE0
T
= 150 °C
j
T
= 25 °C
r
j
CE
V
= 15 V
GE
T
= 150 °C
j
V
V
=V
, I
= 6 mA
GE(th)
GE
CE
C
I
T
= 25 °C
V
= 0 V
j
CES
GE
V
= 1200 V
T
= 150 °C
CE
j
C
f = 1 MHz
ies
V
= 25 V
CE
f = 1 MHz
C
oes
V
= 0 V
GE
C
f = 1 MHz
res
Q
V
= - 8 V...+ 15 V
G
GE
R
Gint
V
= 600 V
t
T
= 150 °C
CC
d(on)
j
I
= 150 A
T
= 150 °C
t
C
r
j
V
= ±15 V
GE
E
T
= 150 °C
R
= 1.5
j
on
G on
T
= 150 °C
t
R
= 1.5
d(off)
j
G off
di/dt
= 4400 A/µs
t
T
= 150 °C
on
j
f
di/dt
= 1800 A/µs
off
du/dt
= 8100 V/
E
T
= 150 °C
off
j
off
µs
R
per IGBT
th(j-c)
Rev. 4 – 23.03.2011
Values
Unit
1200
V
231
A
176
A
150
A
450
A
-20 ... 20
V
10
µs
-40 ... 175
°C
189
A
141
A
150
A
450
A
900
A
-40 ... 175
°C
200
A
-40 ... 125
°C
4000
V
min.
typ.
max.
Unit
1.75
2.20
V
2.20
2.50
V
0.94
1.04
V
0.88
0.98
V
5.40
7.7
m
8.80
10.13
m
5.5
6
6.5
V
0.1
0.3
mA
mA
9
nF
0.89
nF
0.884
nF
1650
nC
5.0
258
ns
32
ns
13.5
mJ
388
ns
62
ns
14.2
mJ
0.19
K/W
1