IXFH52N30Q IXYS SEMICONDUCTOR, IXFH52N30Q Datasheet
IXFH52N30Q
Manufacturer Part Number
IXFH52N30Q
Description
MOSFET, N, TO-247
Manufacturer
IXYS SEMICONDUCTOR
Datasheet
1.IXFH52N30Q.pdf
(2 pages)
Specifications of IXFH52N30Q
Transistor Polarity
N Channel
Continuous Drain Current Id
52A
Drain Source Voltage Vds
300V
On Resistance Rds(on)
60mohm
Rds(on) Test Voltage Vgs
10V
Voltage Vgs Max
20V
Operating Temperature Range
-55°C To
Threshold Voltage Vgs Typ
4V
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
IXFH52N30Q
Manufacturer:
IXYS
Quantity:
73
Company:
Part Number:
IXFH52N30Q
Manufacturer:
FSC
Quantity:
20 000
© 2000 IXYS All rights reserved
HiPerFET
Power MOSFETs
Q-Class
N-Channel Enhancement Mode
Avalanche Rated, High dv/dt, Low t
Low Gate Charge and Capacitances
Preliminary data
Symbol
V
V
V
V
I
I
I
E
E
dv/dt
P
T
T
T
T
M
Weight
Symbol
V
V
I
I
R
IXYS reserves the right to change limits, test conditions, and dimensions.
D25
DM
AR
GSS
DSS
J
JM
stg
L
DGR
AR
AS
D
DSS
GS
GSM
DSS
GS(th)
DS(on)
d
Test Conditions
T
T
Continuous
Transient
T
T
T
T
T
I
T
T
1.6 mm (0.063 in) from case for 10 s
Mounting torque
Test Conditions
V
V
V
V
V
V
Pulse test, t £ 300 ms, duty cycle d £ 2 %
S
C
C
C
C
C
C
J
J
J
GS
DS
GS
DS
GS
GS
= 25°C to 150°C
= 25°C to 150°C; R
= 25°C, Chip capability
= 25°C, pulse width limited by T
= 25°C
= 25°C
= 25°C
£ I
£ 150°C, R
= 25°C
= 0 V, I
= V
= ±20 V
= V
= 0 V
= 10 V, I
DM
TM
, di/dt £ 100 A/ms, V
GS
DSS
, I
D
D
DC
D
= 1 mA
= 4 mA
, V
= 0.5 • I
G
= 2 W
DS
= 0
D25
GS
= 1 MW
DD
T
T
£ V
J
J
(T
= 25°C
= 125°C
DSS
rr
J
= 25°C, unless otherwise specified)
JM
TO-247
TO-264
TO-247
TO-264
TO-268
,
IXFH 52N30Q
IXFK 52N30Q
IXFT 52N30Q
min.
300
Characteristic Values
-55 ... +150
-55 ... +150
2
Maximum Ratings
typ.
1.13/10 Nm/lb.in.
0.9/6 Nm/lb.in.
150
300
300
±20
±30
208
360
300
1.5
52
52
30
10
5
6
4
max.
±200
50
60 mW
4
1 mA
V/ns
mJ
°C
nA
mA
W
°C
°C
°C
V
V
V
V
A
A
A
V
V
g
g
g
J
TO-247 AD (IXFH)
TO-268 (D3) ( IXFT)
TO-264 AA (IXFK)
G = Gate
S = Source
Features
• Low gate charge
• International standard packages
• Epoxy meet UL 94 V-0, flammability
• Low R
• Rugged polysilicon gate cell structure
• Avalanche energy and current rated
• Fast intrinsic Rectifier
Advantages
• Easy to mount
• Space savings
• High power density
classification
V
I
R
t
D25
rr
DS(on)
DSS
DS (on)
G
HDMOS
G
D
= 300
=
=
£ 250 ns
S
S
TAB = Drain
TM
52
60 mW
process
98522B (7/00)
V
A
D (TAB)
(TAB)
(TAB)
1 - 2
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IXFH52N30Q Summary of contents
Page 1
TM HiPerFET Power MOSFETs Q-Class N-Channel Enhancement Mode Avalanche Rated, High dv/dt, Low t Low Gate Charge and Capacitances Preliminary data Symbol Test Conditions 25°C to 150°C DSS 25°C to 150°C; R DGR ...
Page 2
Symbol Test Conditions 0.5 • iss MHz oss rss t d(on ...