BSP89 Infineon Technologies, BSP89 Datasheet

MOSFET, N, LOGIC, SOT-223

BSP89

Manufacturer Part Number
BSP89
Description
MOSFET, N, LOGIC, SOT-223
Manufacturer
Infineon Technologies
Datasheet

Specifications of BSP89

Transistor Polarity
N Channel
Continuous Drain Current Id
360mA
Drain Source Voltage Vds
240V
On Resistance Rds(on)
6ohm
Rds(on) Test Voltage Vgs
10V
Voltage Vgs Max
20V
Operating Temperature
RoHS Compliant
Threshold Voltage Vgs Typ
1.4V
Rohs Compliant
Yes
Package
SOT-223
Vds (max)
240.0 V
Rds (on) (max) (@10v)
6,000.0 mOhm
Rds (on) (max) (@4.5v)
7,500.0 mOhm
Rds (on) (max) (@2.5v)
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BSP89
Manufacturer:
NS
Quantity:
2
Part Number:
BSP89
Manufacturer:
INF
Quantity:
12 800
Part Number:
BSP89
Manufacturer:
NXP
Quantity:
51 000
Part Number:
BSP89
Manufacturer:
PHL/INF
Quantity:
20 000
Part Number:
BSP89
Quantity:
700
Company:
Part Number:
BSP89
Quantity:
714
Part Number:
BSP89 E6327
Manufacturer:
XILINX
0
Part Number:
BSP89 E6327
Manufacturer:
SIEMENS
Quantity:
18 988
Part Number:
BSP89 H6327
Manufacturer:
INFINEON
Quantity:
34 000
Company:
Part Number:
BSP89 H6327
Quantity:
4 800
Part Number:
BSP89115
Manufacturer:
NXP Semiconductors
Quantity:
119 928
Feature
· N-Channel
· Enhancement mode
· Logic Level
· dv/dt rated
SIPMOS Ò Small-Signal-Transistor
Type
BSP89
BSP89
Maximum Ratings, at T
Parameter
Continuous drain current
T
T
Pulsed drain current
T
Reverse diode dv/dt
I
Gate source voltage
ESD Sensitivity (HBM) as per MIL-STD 883
Power dissipation
T
Operating and storage temperature
IEC climatic category; DIN IEC 68-1
S
A
A
A
A
Pb-free lead plating; RoHS compliant
=0.35A, V
=25°C
=70°C
=25°C
=25°C
DS
=192V, di/dt=200A/µs, T
Package
P-SOT-223
PG-SOT-223
j
= 25 °C, unless otherwise specified
Tape and Reel Information
E6327: 1000 pcs/reel
L6327: 1000 pcs/reel
jmax
=150°C
Rev. 1.21
Page 1
Symbol
I
I
dv/dt
V
P
T
D
D puls
j ,
GS
tot
T
stg
Marking
BSP89
BSP89
-55... +150
55/150/56
Class 1
Product Summary
V
R
I
D
Value
DS
DS(on)
0.35
0.28
±20
1.4
1.8
6
PG-SOT-223
4
2006-09-27
0.35
240
6
1
BSP89
Unit
A
kV/µs
V
W
°C
2
VPS05163
V
W
A
3

Related parts for BSP89

BSP89 Summary of contents

Page 1

... L6327: 1000 pcs/reel = 25 °C, unless otherwise specified Symbol puls dv/dt =150°C jmax Page 1 Product Summary DS(on PG-SOT-223 4 Marking BSP89 BSP89 Value 0.35 0.28 1.4 6 ±20 GS Class 1 1.8 tot T -55... +150 stg 55/150/56 BSP89 240 0. VPS05163 Unit A kV/µ °C 2006-09-27 ...

Page 2

... Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain connection. PCB is vertical without blown air. Rev. 1.21 Symbol R thJS R thJA = 25 °C, unless otherwise specified j Symbol V (BR)DSS = GS(th) I DSS I GSS R DS(on) R DS(on) Page 2 BSP89 Values Unit min. typ. max K 115 - - 70 Values Unit min. typ. max. 240 - - V 0.8 1 ...

Page 3

... Q V =192V, I =0.35A =192V, I =0.35A 10V GS V (plateau) V =192V 0. =25° = =120V /dt=100A/µ Page 3 BSP89 Values min. typ. max. 0.18 0. 140 - 11.2 16.8 - 5.2 7 3.5 5.3 - 15.9 23.8 - 18.4 27.6 - 0.2 0 4.3 6 1.4 - 0.85 1 100 - 123 184 2006-09-27 ...

Page 4

... Drain current parameter: V 0.38 A 0.32 0.28 0.24 0.2 0.16 0.12 0.08 0.04 °C 100 120 160 Transient thermal impedance Z thJA parameter : K 160.0µ Page ³ BSP89 100 120 = BSP89 1 0 single pulse - 2006-09-27 BSP89 °C 160 0.50 0.20 0.10 0.05 0.02 0. ...

Page 5

... Rev. 1.21 6 Typ. drain-source on resistance R DS(on) parameter 3.4V 3.6V 4.2V 4. 10V 3 3 Typ. forward transconductance g = f(I DS(on)max fs parameter 2 Page ° 0.1 0.2 0.3 0 °C j 0.6 S 0.4 0.3 0.2 0 0.1 0.2 0.3 0.4 BSP89 3V 3.4V 3.6V 4.2V 4. 10V 2006-09-27 ...

Page 6

... Forward character. of reverse diode °C parameter Page =108µ 2.2 V 98% 1.8 1.6 typ. 1.4 1 0.8 0.6 0.4 0.2 0 -60 - BSP89 °C typ 150 °C typ °C (98 150 °C (98 0.4 0.8 1.2 1.6 2 BSP89 °C 100 160 2006-09-27 ...

Page 7

... Typ. gate charge parameter 0.35 A pulsed BSP89 0 max 8 0 max 0 max Rev. 1.21 14 Drain-source breakdown voltage , V DS (BR)DSS = 25 °C j 291 V 276 271 266 261 256 251 246 241 236 231 226 221 216 6 Page BSP89 -60 - 100 2006-09-27 BSP89 °C 180 T j ...

Page 8

... Life support devices or systems are intended to be implanted in the human body support and/or maintain and sustain and/or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Rev. 1.21 Page Page 8 BSP89 2006-09-27 ...

Related keywords