IXFH50N20 IXYS SEMICONDUCTOR, IXFH50N20 Datasheet

MOSFET, N, TO-247

IXFH50N20

Manufacturer Part Number
IXFH50N20
Description
MOSFET, N, TO-247
Manufacturer
IXYS SEMICONDUCTOR
Datasheet

Specifications of IXFH50N20

Transistor Polarity
N Channel
Continuous Drain Current Id
50A
Drain Source Voltage Vds
200V
On Resistance Rds(on)
45mohm
Rds(on) Test Voltage Vgs
10V
Voltage Vgs Max
20V
Operating Temperature Range
-55°C To
Threshold Voltage Vgs Typ
4V
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IXFH50N20
Manufacturer:
IXYS
Quantity:
167
Part Number:
IXFH50N20
Manufacturer:
FUJI
Quantity:
6 000
Part Number:
IXFH50N20
Manufacturer:
ST
0
© 2000 IXYS All rights reserved
HiPerFET
Power MOSFETs
Symbol
V
V
V
V
I
I
I
E
dv/dt
P
T
T
T
T
M
Weight
Symbol
V
V
I
I
IXYS reserves the right to change limits, test conditions, and dimensions.
N-Channel Enhancement Mode
High dv/dt, Low t
D25
DM
AR
GSS
DSS
J
JM
stg
L
DGR
AR
D
DSS
GS
GSM
DSS
GS(th)
d
Test Conditions
T
T
Continuous
Transient
T
T
T
T
I
T
T
1.6 mm (0.062 in.) from case for 10 s
Mounting torque
Test Conditions
V
V
V
V
S
V
C
C
C
C
C
J
J
J
GS
DS
GS
DS
GS
£ 150°C, R
= 25°C to 150°C
= 25°C to 150°C; R
= 25°C
= 25°C, pulse width limited by T
= 25°C
= 25°C
£ I
= 25°C
= 0 V, I
= V
= ±20 V
= 0.8 • V
= 0 V
TM
DM
, di/dt £ 100 A/ms, V
GS
rr
, HDMOS
, I
D
D
DC
= 250 mA
DSS
= 4 mA
G
, V
= 2 W
DS
= 0
TM
GS
= 1 MW
Family
DD
T
T
£ V
J
J
(T
= 25°C
= 125°C
DSS
J
= 25°C, unless otherwise specified)
JM
,
IXFH/IXFM42N20
IXFH/IXFM/IXFT50N20
IXFH/IXFT58N20
42N20
50N20
58N20
42N20
50N20
58N20
42N20
50N20
58N20
TO-204 = 18 g, TO-247 = 6 g
min.
200
Characteristic Values
2
-55 ... +150
-55 ... +150
Maximum Ratings
typ.
1.13/10 Nm/lb.in.
200
200
±20
±30
168
200
232
300
150
300
42
50
58
42
50
58
30
5
max.
±100
200
4
1 mA
V/ns
mJ
nA
mA
°C
°C
°C
°C
W
V
V
V
V
A
A
A
A
A
A
A
A
A
V
V
TO-204 AE (IXFM)
TO-268 (D3) Case Style
G = Gate,
S = Source,
Features
• International standard packages
• Low R
• Rugged polysilicon gate cell structure
• Unclamped Inductive Switching (UIS)
• Low package inductance
• Fast intrinsic Rectifier
Applications
• DC-DC converters
• Synchronous rectification
• Battery chargers
• Switched-mode and resonant-mode
• DC choppers
• AC motor control
• Temperature and lighting controls
• Low voltage relays
Advantages
• Easy to mount with 1 screw (TO-247)
• High power surface mountable package
• High power density
TO-247 AD (IXFH)
rated
- easy to drive and to protect
power supplies
(isolated mounting screw hole)
200 V
200 V
200 V
V
t
DS (on)
DSS
rr
£ 200 ns
HDMOS
G
D = Drain,
TAB = Drain
42 A 60mW
50 A 45mW
58 A 40mW
S
I
TM
D25
process
S
D
91522H (2/98)
R
DS(on)
(TAB)
G
(TAB)
1 - 4

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IXFH50N20 Summary of contents

Page 1

TM HiPerFET Power MOSFETs N-Channel Enhancement Mode High dv/dt, Low t , HDMOS rr Symbol Test Conditions 25°C to 150°C DSS 25°C to 150°C; R DGR J V Continuous GS V Transient GSM ...

Page 2

Symbol Test Conditions (T = 25°C, unless otherwise specified 0.5 I DS(on D25 Pulse test, t £ 300 ms, duty cycle d £ ...

Page 3

Fig. 1 Output Characteristics 100 T = 25° Volts DS Fig vs. Drain Current DS(on) 2.6 2.4 2.2 2.0 ...

Page 4

Fig.7 Gate Charge Characteristic Curve 100V 50A 10mA 100 125 150 175 200 Gate Charge - nCoulombs Fig.9 Capacitance ...

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