CM75TX-24S Powerex Inc, CM75TX-24S Datasheet - Page 4

• Manufacturer Part Number: CM75TX-24S
• Description: IGBT MODULE NX-SERIES 6-PAC DP 1200 75
• Manufacturer: Powerex Inc
• Type: 6-PACr

Specifications of CM75TX-24S

• Prx Availability: RequestQuote
• Voltage: 1200V
• Current: 75A
• Circuit Configuration: 6-Pac
• Rohs Compliant: Yes
• Recommended Gate Driver: M57159L
• Recommended Dc To Dc Converter: VLA106-15242

4
Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697 [phone] www.pwrx.com
CM75TX-24S
Six IGBTMOD™ NX-S Series Module
75 Amperes/1200 Volts
Electrical Characteristics, T
NTC Thermistor Part
Characteristics
Zero Power Resistance
Deviation of Resistance
B Constant
Power Dissipation
Thermal Resistance Characteristics
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Case
Contact Thermal Resistance,
Case to Heatsink
Mechanical Characteristics
Mounting Torque
Weight
Creepage Distance
Clearance
Flatness of Baseplate
Recommended Operating Conditons, T
DC Supply Voltage
Gate-Emitter Drive Voltage
External Gate Resistance
*2 Case temperature (T
*6 B
*7 Typical value is measured by using thermally conductive grease of λ = 0.9 [W/(m • K)].
*8 Baseplate (mounting side) flatness measurement points (X, Y) are shown in the figure below.
(mounting side) of the baseplate and the heatsink side just under the chips.
Refer to the figure to the right for chip location.
The heatsink thermal resistance should be measured just under the chips.
R
R
(25/50)
25
50
; Resistance at Absolute Temperature T
; Resistance at Absolute Temperature T
= In(
R
R
50
25
)/(
*2
T
C
25
1
) and heatsink temperature (T
–
MOUNTING SIDE
T
50
1
MOUNTING SIDE
)
25
50
j
[K]; T
[K]; T
= 25°C unless otherwise specified (continued)
*2
*2
25
50
s
) is measured on the surface
= 25 [°C] + 273.15 = 298.15 [K]
= 50 [°C] + 273.15 = 323.15 [K]
X
MOUNTING
R
R
B
V
Symbol
R
∆R/R
th(j-c)
th(j-c)
GE(on)
(25/50)
V
Y
R
P
th(c-f)
SIDE
M
R
d
d
e
m
CC
25
25
+ : CONVEX
s
a
c
G
s
– : CONCAVE
a
Q
D
= 25°C
Applied Across P-N/P1-N1 Terminals
Mounting to Heatsink, M5 Screw
FWDi Part, Per 1/6 Module
G*P-Es*P/G*N-Es*N Terminals
Approximate by Equation
IGBT Part, Per 1/6 Module
T
C
Thermal Grease Applied,
= 100°C, R
Terminal to Baseplate
Terminal to Baseplate
Terminal to Terminal
Terminal to Terminal
On Centerline X, Y
Test Conditions
T
T
Per 1 Module
Applied Across
C
C
Per Switch
= 25°C
= 25°C
100
*2
*2
= 493Ω
*7
19.9
28.4
0
*8
Each mark points to the center position of each chip.
Tr*P / Tr*N: IGBT
*6
54
55
56
57
58
59
60
61
53
UP
UP
Di
Tr
1
52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31
2
3
UN
UN
Di
Tr
4 5
10.28
14.27
10.28
12.33
Min.
4.85
13.5
Di*P / Di*N: FWDi
-7.3
6
8.2
22
±0
—
—
—
—
—
—
—
7
8
VP
VP
Di
Tr
9 10 11 12 13 14 15 16 17 18 19 20 21 22
VN
VN
Di
Tr
0.015
3375
5.00
15.0
Typ.
300
600
27
—
—
—
—
—
—
—
—
—
—
WP
WP
Di
Tr
Th: NTC Thermistor
WN
WN
Di
Tr
Th
±100
Max.
5.15
0.25
0.40
16.5
+7.8
850
31
82
—
10
—
—
—
—
—
—
LABEL SIDE
30
29
28
27
26
25
24
23
0
21.6
24.1
30.0
12/11 Rev. 3
Grams
Units
Volts
Volts
mW
K/W
K/W
K/W
in-lb
mm
mm
mm
mm
µm
kΩ
%
K
Ω