SEMIX404GB12E4S SEMIKRON, SEMIX404GB12E4S Datasheet

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SEMIX404GB12E4S

Manufacturer Part Number
SEMIX404GB12E4S
Description
IGBT 4 (Trench)
Manufacturer
SEMIKRON
Datasheet

Specifications of SEMIX404GB12E4S

Family/system
SEMiX
Voltage (v)
1200
Current (a)
400
Chip-type
IGBT 4 (Trench)
Case
SEMiX 4s

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SEMIX404GB12E4S
Manufacturer:
SEMIKRON
Quantity:
20 000
SEMiX404GB12E4s
Trench IGBT Modules
SEMiX404GB12E4s
Features
• Homogeneous Si
• Trench = Trenchgate technology
• V
• High short circuit capability
• UL recognized, file no. E63532
Typical Applications*
• AC inverter drives
• UPS
• Electronic Welding
Remarks
• Case temperature limited to T
• Product reliability results are valid for
• For short circuit: Soft R
• Dynamic values apply to the
© by SEMIKRON
SEMiX
coefficient
max.
T
recommended R
following combination of resistors:
R
R
R
R
j
CE(sat)
=150°C
Gon,main
Goff,main
G,X
E,X
= 0,5 Ω
= 2,2 Ω
with positive temperature
= 1,0 Ω
= 1,0 Ω
®
4s
GB
Goff
> 25
Goff
C
=125°C
Absolute Maximum Ratings
Symbol
IGBT
V
I
I
I
V
t
T
Inverse diode
I
I
I
I
T
Module
I
T
V
Characteristics
Symbol
IGBT
V
V
r
V
I
C
C
C
Q
R
t
t
E
t
t
E
R
C
Cnom
CRM
psc
F
Fnom
FRM
FSM
t(RMS)
CE
CES
d(on)
r
d(off)
f
j
j
stg
CES
GES
isol
CE(sat)
CE0
GE(th)
on
off
ies
oes
res
Gint
th(j-c)
G
Rev. 0 – 05.05.2010
T
V
V
V
T
t
I
V
chiplevel
V
V
V
V
V
V
T
V
I
R
R
di/dt
di/dt
Conditions
I
I
AC sinus 50Hz, t = 1 min
Conditions
V
per IGBT
p
C
C
CRM
FRM
j
j
j
CC
GE
CES
GE
GE
GE
CE
CE
GE
GE
CC
GE
G on
G off
= 10 ms, sin 180°, T
= 175 °C
= 175 °C
= 400 A
= 25 °C
= 400 A
=V
= 1200 V
= 25 V
on
off
= 800 V
≤ 20 V
= 15 V
= 15 V
= 0 V
= 0 V
= - 8 V...+ 15 V
= 600 V
= 3xI
= 3xI
≤ 1200 V
= 1.7 Ω
= 1.7 Ω
= 5800 A/µs
= 3700 A/µs
CE
, I
Fnom
Cnom
C
= 15.2 mA
T
T
T
T
T
T
T
T
T
T
T
T
T
f = 1 MHz
f = 1 MHz
f = 1 MHz
T
T
T
T
T
T
c
c
j
c
c
j
j
j
j
j
j
j
j
j
j
j
j
j
j
= 150 °C
j
= 25 °C
= 150 °C
= 25 °C
= 150 °C
= 25 °C
= 150 °C
= 25 °C
= 150 °C
= 150 °C
= 150 °C
= 150 °C
= 150 °C
= 150 °C
= 150 °C
= 25 °C
= 80 °C
= 25 °C
= 80 °C
= 25 °C
min.
5
-40 ... 175
-40 ... 175
-40 ... 125
-20 ... 20
Values
1200
1200
1200
1980
4000
2260
typ.
0.12
24.6
1.62
1.38
1.88
59.7
618
475
400
440
329
400
600
296
634
137
1.8
2.2
0.8
0.7
2.5
3.8
5.8
10
67
27
0.072
max.
2.05
0.36
2.4
0.9
0.8
2.9
4.0
6.5
Unit
Unit
K/W
mΩ
mΩ
mA
mA
nC
mJ
mJ
°C
°C
°C
nF
nF
nF
µs
ns
ns
ns
ns
V
A
A
A
A
V
A
A
A
A
A
A
V
V
V
V
V
V
1

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SEMIX404GB12E4S Summary of contents

Page 1

... SEMiX404GB12E4s ® SEMiX 4s Trench IGBT Modules SEMiX404GB12E4s Features • Homogeneous Si • Trench = Trenchgate technology • V with positive temperature CE(sat) coefficient • High short circuit capability • UL recognized, file no. E63532 Typical Applications* • AC inverter drives • UPS • Electronic Welding Remarks • Case temperature limited to T =125° ...

Page 2

... SEMiX404GB12E4s ® SEMiX 4s Trench IGBT Modules SEMiX404GB12E4s Features • Homogeneous Si • Trench = Trenchgate technology • V with positive temperature CE(sat) coefficient • High short circuit capability • UL recognized, file no. E63532 Typical Applications* • AC inverter drives • UPS • Electronic Welding Remarks • Case temperature limited to T =125° ...

Page 3

... SEMiX404GB12E4s Fig. 1: Typ. output characteristic, inclusive R Fig. 3: Typ. turn-on /-off energy = f (I Fig. 5: Typ. transfer characteristic © by SEMIKRON Fig. 2: Rated current vs. temperature I CC'+ EE' ) Fig. 4: Typ. turn-on /-off energy = Fig. 6: Typ. gate charge characteristic Rev. 0 – 05.05.2010 = ...

Page 4

... SEMiX404GB12E4s Fig. 7: Typ. switching times vs. I Fig. 9: Typ. transient thermal impedance Fig. 11: Typ. CAL diode peak reverse recovery current 4 Fig. 8: Typ. switching times vs. gate resistor R C Fig. 10: Typ. CAL diode forward charact., incl. R Fig. 12: Typ. CAL diode recovery charge Rev. 0 – 05.05.2010 ...

Page 5

... SEMiX404GB12E4s SEMiX 4s spring configuration This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX * The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our personal. © ...

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