ACPM-7331-BLK Avago Technologies US Inc., ACPM-7331-BLK Datasheet
ACPM-7331-BLK
Specifications of ACPM-7331-BLK
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ACPM-7331-BLK Summary of contents
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... This power amplifier module is developed to cover 1850-1910MHz bandwidth. The ACPM-7331 meets the stringent WCDMA linearity require- ments for output power 28.5dBm. The ACPM- 7331 is also developed to meet HSDPA specs. The ACPM-7331 is designed to enhance the efficiency at low and medium output power range by using 3-mode control scheme with 2 mode control pins ...
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Table 1. Absolute Maximum Ratings Parameter Symbol RF Input Power Pin DC Supply Voltage Vcc Enable Voltage Ven Mode Control Voltage Vmode0 Vmode Storage Temperature Tstg Table 2. Recommended Operating Condition Parameter Symbol DC Supply Voltage Vcc PA Enable ...
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Table 4. Electrical Characteristics for WCDMA Mode (Vcc=3.4V, Ven=2.6V, T=25°C, Zin/Zout=50ohm) Characteristics Symbol Operating Frequency Range F Gain Gain_hi Gain_mid Gain_low Power Added Efficiency PAE_hi PAE_mid PAE_low Total Supply Current Icc_hi Icc_mid Icc_low Quiescent Current Iq_hi Iq_mid Iq_low Enable Current ...
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Table 5. Electrical Characteristics for HSDPA Mode (Vcc=3.4V, Ven=2.6V, T=25°C, Zin/Zout=50ohm) Characteristics Operating Frequency Range Gain Power Added Efficiency Total Supply Current Adjacent Channel 5 MHz offset [] Leakage Ratio 0 MHz offset 5 MHz offset 0 MHz offset 5 ...
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Characteristics Data (WCDMA, Vcc=3.4V, Ven=2.6V, T=25°C, Zin/Zout=50ohm) 650 600 550 500 450 185GHz 400 188GHz 350 191GHz 300 250 200 150 100 Pout (dBm) Figure 1. Total Current vs. Output Power 45 40 ...
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Characteristics Data (HSDPA, Vcc=3.4V, Ven=2.6V, T=25°C, Zin/Zout=50ohm) 650 600 550 185GHz 500 188GHz 450 191GHz 400 350 300 250 200 150 100 Pout (dBm) Figure 6. Total Current vs. Output Power 45 40 ...
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... RF In Vmode1 3 Vmode1 C3 100pF Vmode0 4 Vmode0 C2 Ven 100pF 5 Ven C1 100pF Figure 11. Evaluation Board Schematic C5 C4 ○ AVAGO ACPM -7331 PYYWW THAAAAAA Figure 12. Evaluation Board Assembly Diagram Pin 1 Mark AVAGO ACPM-7331 PYYWW THAAAAAA Figure 13. Marking Specifications 7 Vcc2 10 C6 220pF GND 9 RF Out 8 ...
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Package Dimensions and Pin Descriptions Pin 1 Mark ± 0.1 TOP VIEW 1.20 1.90 1.90 1.70 0.85 X-RAY BOTTOM VIEW Figure 14. Package Dimensional Drawing and Pin Descriptions (All dimensions are in millimeters) 8 ...
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... The ACPM-7331, as part of optimized design, meets the necessary linearity require- ments over a 4:1 VSWR mismatch at the antenna plane. In the case of the ACPM-7331, the output stage has been designed for slightly higher Pout to provide the necessary margin to meet linearity under the mismatch experienced at the PA output port resulting from the forced antenna mismatch ...
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PHASE (degree) (1) Pout vs. Phase 24.0 22.0 20.0 18.0 16.0 14.0 12 100 150 200 PHASE (degree) (3) Gain vs. Phase -20.0 -30.0 -40.0 -50.0 ...
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... PCB Design Guidelines The recommended ACPM-7331 PCB land pattern is shown in Figure 18 and Figure 19. The substrate is coated with solder mask between the I/O and conductive paddle to protect the gold pads from short circuit that is caused by solder bleeding/bridging. Stencil Design Guidelines A properly designed solder screen or stencil is required to ensure optimum amount of solder paste is deposited onto the PCB pads ...
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Tape and Reel Information Dimension List Dimension Millimeter Dimension A0 4.40±0.0 B0 4.40±0.0 K0 .70±0.0 D0 .55±0.05 D .60±0.0 P0 4.00±0.0 P 8.00±0.0 Figure 21. Tape and Reel Format – mm. Millimeter P .00±0.05 P0 ...
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Reel Drawing BACK VIEW 25 min wide (ref) Slot for carrier tape insertion for attachment to reel hub (2 places 180° apart) FRONT VIEW 1.5 min. 13.0 ± 0.2 21.0 ± 0.8 Figure 22. Plastic Reel Format (all dimensions are ...
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... After this time period, the part would need to be removed from the reel, de-taped and then re-baked. MSL classification reflow temperature for the ACPM-7331 is targeted at 260°C +0/-5°C. Figure 23 and Table 8 show typical SMT profile for maximum tem- perature of 260 +0/-5°C. ...
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max Ts min ts Preheat Peak Figure 23. Typical SMT Reflow Profile for Maximum Temperature = 260 +0/-5°C Table 8. Typical SMT Reflow Profile for Maximum Temperature = 260+0 / ...
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Storage Condition Packages described in this document must be stored in sealed moisture barrier, antistatic bags. Shelf life in a sealed moisture barrier bag is 12 months at <40°C and 90% relative humidity (RH) J-STD-033 p.7. Out-of-Bag Time Duration After ...
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Table 9. Recommended Equivalent Total Floor Life (days °C , 25°C & 30°C For ICs with Novolac, Biphenyl and Multifunctional Epoxies (Reflow at same temperature at which the component was classified) Maximum Percent Relative Humidity Package Type and ...
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For product information and a complete list of distributors, please go to our web site: Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright ...