32-6554-10 Aries Electronics, 32-6554-10 Datasheet

32 PIN ZIF SOCKET, TIN

32-6554-10

Manufacturer Part Number
32-6554-10
Description
32 PIN ZIF SOCKET, TIN
Manufacturer
Aries Electronics
Series
X55Xr
Type
DIP, ZIF (ZIP)r
Datasheet

Specifications of 32-6554-10

Pitch
0.100" (2.54mm)
Number Of Positions Or Pins (grid)
32 (2 x 16)
Mounting Type
Through Hole
Features
Closed Frame
Contact Finish
Tin
Contact Finish Thickness
10µin (0.25µm)
Product
DIP / SIP Sockets
Number Of Rows
2
Contact Plating
Tin over Nickel
Mounting Style
Through Hole
Termination Style
Solder Pin
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
A304
FEATURES
GENERAL SPECIFICATIONS
MOUNTING CONSIDERATIONS
• Aries Universal Test Socket accepts devices on 0.300 to 0.600 [7.62 to 15.24] cen-
• All pin count sockets go into PCB with either 0.300 or 0.600 [7.62 to 15.24] centers.
• Contacts are normally closed to eliminate dependence on plastic to sustain contact.
• Socket handle can be configured with closed contacts (on) when in the UP or DOWN
• Sockets can be soldered into PCBs or plugged into any socket. Socket fits into Aries’
• SOCKET BODY: black UL 94V-0 glass-filled Polyphenylene Sulfide (PPS)
• HANDLE: Stainless Steel
• HANDLE KNOB: Brass 360, 1/2-hard
• CONTACTS: BeCu 172 per QQ-C-533 or BeNi 360 1/2-hard
• CONTACT PLATING: 50μ [1.27μ] min. Ni under-plate per QQ-N-290, over-plated
• BeNi CONTACT PLATING: 50μ [1.27μ] min. NiB
• CONTACT CURRENT RATING: 1 amp
• INSULATION RESISTANCE: 1000 mΩ min.
• DIELECTRIC WITHSTANDING VOLTAGE: 1000 VAC
• LIFE CYCLE: 25,000 to 50,000 cycles
• OPERATING TEMPERATURE: -67°F [-55°C] min.;
• RETENTION FORCE (closed): 55g/pin based on a
• ACCEPTS LEADS: 0.015-0.045 [0.38-1.14] wide,
• See Socket Footprint below
ters.
position, and can be mounted on either the right or left side.
or any competitive test socket receptacle.
with either 200μ [5.08μ] min. matte Sn per ASTM
B545-97 or 200μ [5.08μ] 90/10 Sn/Pb per MIL-
T-10727 or 10μ [0.254μ] min. Au per MIL-G-45204
221°F [105°C] max. for Sn plating; 302°F [150°C]
for Au plating; 392°F [200°C] for NiB plating
0.020 [0.51] dia. test lead
0.110-0.280 [2.79-7.11] long
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
Series X55X Universal Zero-Insertion-Force
DIP Test Socket
Bristol, PA 19007-6810 USA
TEL (215) 781-9956 • FAX (215) 781-9845
WWW.ARIESELEC.COM
• INFO@ARIESELEC.COM
Pins
Row-to-Row Spacing (btm)
24, 28, 32, 36,
40, 42, 44, 48
3 = 0.300 [7.62]
6 = 0.600 [15.24]
ALL DIMENSIONS: INCHES [MILLIMETERS]
ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED
“A” = (NO. OF PINS PER ROW x 0.100 [2.54]) + 0.590 [14.99]
“B” = (NO. OF PINS PER ROW -1) x 0.100 [2.54]
“C” = (NO. OF PINS PER ROW x 0.100 [2.54] + 0.415 [10.54]
CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS
ORDERING INFORMATION
XX-X55X-1 X
CUSTOMIZATION: In addition to the standard products shown
on this page, Aries specializes in custom design and production.
Special materials, platings, sizes, and configurations can be
furnished, depending on the quantity. NOTE: Aries reserves the
right to change product general specifications without notice.
Plating
Solder Pin Tail
Handle Options
NOTE: “on” = closed contacts
0TL = Sn/Pb over Ni
0 = Sn over Ni
1 = Au over Ni
6 = NiB BeNi Contact Only
1 = Left, up is on
2 = Right, up is on
3 = Left, down is on
4 = Right, down is on (std)
Rev. AB
10001

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