ICK BGA 35X35 FISCHER ELEKTRONIK, ICK BGA 35X35 Datasheet

ICK BGA 35X35

Manufacturer Part Number

ICK BGA 35X35

Description

HEAT SINK, BALL GRID

Manufacturer

FISCHER ELEKTRONIK

Datasheet

1.ICK_BGA_35X35.pdf (1 pages)

Specifications of ICK BGA 35X35

Packages Cooled

BGA

Thermal Resistance

17Â°C/W

External Width

35mm

Height

6mm

Heat Sink Material

Aluminium

External Depth

35mm

External Length / Height

6mm

Surface Finish

Plain

External Height

6mm

Rohs Compliant

Yes

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

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Heatsinks for PGAs and BGAs

ICK BGA 35 x 35

WLF ... 35 x 35

ICK BGA 35 x 35 x 10

WLF ... 35 x 35

ICK BGA 40 x 40

WLF ... 40 x 40

ICK BGA 40 x 40 x 10

WLF ... 40 x 40

ICK BGA 42,5 x 45

WLF ... 42,5 x 45

B 15

art. no.

Thermal conduct. foil WLFT 404/405

Thermal conductive glue

Thermal conductive paste

Processor overview

E 5

E 14

E 12

B 2 - 7

Hola1

SMD-heatsinks

Mounting material for semiconduct.

Hole pattern

Technical introduction

B 25 – 27

E 34 – 38

A 21

A 2 - 7

Related parts for ICK BGA 35X35

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ICK BGA 35X35 pdf datasheet
ICK BGA 35X35 component
ICK BGA 35X35 part
ICK BGA 35X35 distributor
ICK BGA 35X35 RoHS
ICK BGA 35X35 datasheet download