IC SOCKET BGA 0.5MM 25X25

1921125-5

Manufacturer Part Number1921125-5
DescriptionIC SOCKET BGA 0.5MM 25X25
ManufacturerTyco Electronics
TypeBGA
1921125-5 datasheet
 

Specifications of 1921125-5

Number Of Positions Or Pins (grid)625 (25 x 25)Pitch0.020" (0.50mm)
Mounting TypeThrough HoleFeaturesClosed Frame
Contact FinishSilverLead Free Status / RoHS StatusLead free / RoHS Compliant
Contact Finish Thickness-Other namesA97437
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0.5 mm LGA/BGA Sockets
0.5 mm LGA/BGA Sockets
DESCRIPTION
DESCRIPTION
Tyco Electronics’ polymer interconnect
technology optimizes socketing of
0.5 mm pitch LGA or BGA devices.
This highly conductive polymer contact
provides electrically transparent signal
transfer.
APPLICATIONS
APPLICATIONS
• Silicon validation
• Customer reference designs
• System test and bring up
• Wafer test
KEY FEATURES
KEY FEATURES
• Solderless contact polymer contact allows for easy socket replacement
• Light compression load of 25 grams/contact limits stress on the substrate
• Flexible manufacturing process allows for asymmetrical contact patterns
• Standard array sizes available up to 40 x 40 contacts (1600 I/O)
• Compact design minimizes real estate required
• BGA sockets accommodate multiple ball sizes
• RoHs complaint
FOR MORE INFORMATION
FOR MORE INFORMATION
Technical Support
Internet:
http://www.tycoelectronics.com
USA: 1-800-522-6752
Canada: 1-905-470-4425
UK: 44-141-810-8967
Japan: 81-44-844-8013
Jeff Mason, Business Development Manager
Phone: 1-508-699-9818
Fax:
1-508-695-8111
E-mail:
jeff_mason@tycoelectronics.com
Allison Bobrowski, Sr. Product Specialist
Phone: 1-508-699-9851
Fax: 1-508-695-8111
E-mail:
allison_bobrowski@tycoelectronics.com

1921125-5 Summary of contents

  • Page 1

    ... LGA/BGA Sockets 0.5 mm LGA/BGA Sockets DESCRIPTION DESCRIPTION Tyco Electronics’ polymer interconnect technology optimizes socketing of 0.5 mm pitch LGA or BGA devices. This highly conductive polymer contact provides electrically transparent signal transfer. APPLICATIONS APPLICATIONS • Silicon validation • Customer reference designs • System test and bring up • ...

  • Page 2

    ... LOAD Well Anti-overstress Stop Polyimide Substrate The Matrix series sockets are available as fully arrayed sockets contacts, 1600 I/O. Consult Tyco Electronics for custom socket and hardware solutions. 0.5mm LGA/BGA Sockets 0.5mm LGA/BGA Sockets LGA Pad Contact Bolster Plate BGA Package BGA Ball ...

  • Page 3

    ... PRODUCT CHARACTERISTICS All sockets are compression mount and require a hardware system to generate the necessary forces. Tyco Electronics offers a complete hardware solution for each socket size. Below is a typical socket and hardware stack-up. The spring plate assembly provides a universal compression load and the bolster plate eliminates PCB bow. ...

  • Page 4

    PRODUCT DIMENSIONS PRODUCT DIMENSIONS Note: All part numbers are RoHS compliant. 0.5mm LGA/BGA Sockets 0.5mm LGA/BGA Sockets Page 4 ...

  • Page 5

    PRODUCT DIMENSIONS PRODUCT DIMENSIONS Note: All part numbers are RoHS compliant. 0.5mm LGA/BGA Sockets 0.5mm LGA/BGA Sockets Page 5 ...

  • Page 6

    PRODUCT SPECIFICATIONS PRODUCT SPECIFICATIONS Material: Contact: Proprietary compound of Polymer and Silver Insulator: Polyimide Frame: Thermoplastic, 94V-O or Polyimide Insulator to Frame Adhesive: Acrylic Mechanical: Compression Force: 25 grams per contact average Durability: 40 cycles PCB Thickness Range: .062” to ...

  • Page 7

    ... Tyco Electronics’ only obligations are those in the Tyco Electronics Standard Terms and Conditions of Sale, and in no case will Tyco Electronics be responsible for any incidental, indirect, or consequential damages arising from the sale, resale, or misuse of its products ...