RTV-160 MOMENTIVE PERFORMANCE MATERIALS, RTV-160 Datasheet - Page 3

• Manufacturer Part Number: RTV-160
• Description: SILICONE 1PART ADH, CART, 10.1FL.OZ
• Manufacturer: MOMENTIVE PERFORMANCE MATERIALS
• Series: RTV-160r

Specifications of RTV-160

• Adhesive Type: Silicone - 1 Part
• Color: White
• Dispensing Method: Cartridge
• Volume: 10.1fl.oz. (US)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

APPLICATIONS
APPLICATIONS
SEALING & ADHESION
COATING
The Coating process involves the
application of silicone in a thin
protective layer to a component
surface by methods such as
dip, flow, spray, and selective
robotic coating. Selection of a
silicone coating material for a
particular application involves
the consideration of various
performance and processing
criteria.
POTTING & ENCAPSULATION
Silicones are used in a wide array of applications for bonding components,
and sealing against moisture or environmental contaminants.
comprehensive portfolio of 1 Part and 2 Part Adhesives and Sealants,
many of which are excellent candidates for assembly applications on or
near sensitive electrical and electronic components, are available.
materials are applied by a variety of methods ranging from manual
dispensing to auto-dispensing units for tube, cartridge, pail, or drum packages.
may be accomplished by either manual processes or meter mix dispensing, depending on production
volume and post-mix material properties.
Silicone rubber and gels are widely used in electronics to ensure
mechanical and environmental protection. A full range of products
- Temperature Resistance - Dielectric Resistance
- Flame Retardancy
- Adhesion
- Hardness
Performance Considerations
are offered in various cure speeds,
viscosities, and performance, many of
which offer enhancements for thermal
cycling protection, stress relief, material
strength, flame retardancy, or optical
clarity.
- Low Volatility
- Mechanical Strength
- Thermal Conductivity
- Viscosity
- Cure Temperature
- Pot Life
These
- Temperature Resistance
- Flame Retardancy
- Adhesion
- Release Properties
- Temperature Resistance
- Flame Retardancy
- Stress Relief
Process Considerations
- Viscosity
- Cure Temperature
- Pot Life
- Viscosity
- Cure Temperature
- Pot Life
A
Performance Considerations
Performance Considerations
Process Considerations
Process Considerations
Mixing for 2 Part grades
- Cure Mechanism
- Cure Time
- Dielectric Resistance
- Low Volatility
- Stress Relief
- Thermal Conductivity
- Dielectric Resistance
- Low Volatility
- Cure Mechanism
- Cure Time
- Cure Mechanism
- Cure Time
2