MSA-0300-GP4 Avago Technologies US Inc., MSA-0300-GP4 Datasheet

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MSA-0300-GP4

Manufacturer Part Number
MSA-0300-GP4
Description
GAAS AND SILICON RFIC
Manufacturer
Avago Technologies US Inc.
Type
General Purposer
Datasheet

Specifications of MSA-0300-GP4

Frequency Rf
6GHz
Noise Figure Typ
6dB
Supply Voltage Range
4.5V To 5.5V
Supply Current
50mA
Power Dissipation Pd
425mW
Rf Type
General Purpose
Gain
12.5dB
Frequency
100MHz ~ 3GHz
Noise Figure
6dB
P1db
10dBm
Package / Case
Die
Test Frequency
1GHz
Voltage - Supply
4.5 V ~ 5.5 V
Number Of Channels
1
Frequency (max)
25GHz
Output Power
10@1000MHzdBm
Power Supply Requirement
Single
Single Supply Voltage (min)
4.5V
Single Supply Voltage (typ)
5V
Single Supply Voltage (max)
5.5V
Package Type
Chip
Dual Supply Voltage (min)
Not RequiredV
Dual Supply Voltage (typ)
Not RequiredV
Dual Supply Voltage (max)
Not RequiredV
Filter Terminals
SMD
Frequency Range
0.1GHz To 3GHz
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Supply
-
Lead Free Status / Rohs Status
Compliant
MSA-0300
Cascadable Silicon Bipolar MMIC Amplifier
Data Sheet
Description
The MSA-0300 is a high performance silicon bipolar
Monolithic Microwave Integrated Circuit (MMIC) chip.
This MMIC is designed for use as a general purpose 50
Ω gain block. Typical applications include narrow and
broad band IF and RF amplifiers in commercial, industrial
and military applications.
The MSA-series is fabricated using HP’s 10 GHz f
f
alignment, ion implantation, and gold metallization to
achieve excellent performance, uniformity and reliability.
The use of an external bias resistor for temperature and
current stability also allows bias flexibility.
The recommended assembly procedure is gold-eutectic
die attach at 400°C and either wedge or ball bonding
using 0.7 mil gold wire.
“Chip Use”.
Typical Biasing Configuration
IN
MAX
, silicon bipolar MMIC process which uses nitride self-
C
block
MSA
[1]
V
See APPLICATIONS section,
d
= 5 V
RFC (Optional)
R
C
bias
block
V
OUT
CC
T
, 25 GHz
> 7 V
Features
• Cascadable 50 Ω Gain Block
• 3 dB Bandwidth: DC to 2.8 GHz
• 12.0 dB Typical Gain at 1.0 GHz
• 10.0 dBm Typical P 1 dB at 1.0 GHz
Chip Outline
Note:
1. This chip contains additional biasing options. The performance
specified applies only to the bias option whose bond pads are
indicated on the chip outline. Refer to the APPLICATIONS section
“Silicon MMIC Chip Use” for additional information.
[1]

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MSA-0300-GP4 Summary of contents

Page 1

... This MMIC is designed for use as a general purpose 50 Ω gain block. Typical applications include narrow and broad band IF and RF amplifiers in commercial, industrial and military applications. The MSA-series is fabricated using HP’s 10 GHz silicon bipolar MMIC process which uses nitride self- MAX alignment, ion implantation, and gold metallization to achieve excellent performance, uniformity and reliability ...

Page 2

... The recommended operating current range for this device mA. Typical performance as a function of current is on the following page performance of the chip is determined by packaging and testing 10 devices per wafer in a dual ground configuration. Part Number Ordering Information Part Number MSA-0300-GP4  Absolute Maximum [ 425 mW +13 dBm 200˚ ...

Page 3

... MSA-0300 Typical Scattering Parameters[ Freq. 11 GHz Mag 0.1 .13 -179 0.2 .13 -179 0.4 .12 -179 0.6 .11 -177 0.8 .11 -172 1.0 .10 -166 1.5 .11 -145 2.0 .16 -140 2.5 .23 -141 3.0 .29 -149 3.5 .35 -157 4.0 .38 -164 5.0 .41 179 6.0 .43 153 Note: 1. S-parameters are de-embedded from 70 mil package measured data using the package model found in the DEVICE MODELS section. ...

Page 4

... MSA-0300 Chip Dimensions NOT APPLICABLE INPUT GROUND 365 µm 14.4 mil Unless otherwise specified, tolerances are ±13µm / ±0.5 mils. Chip thickness is 5.5 ± 0.5 mils. Bond Pads are 41µm/1.6 mil typical on each side. Note 1: Output contact is made by die attaching the backside of the die ...

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