04023J1R0ABWTR AVX Corporation, 04023J1R0ABWTR Datasheet - Page 17

Capacitor,Silicon,1pF,25VDC,.05-pF Tol,.05+pf Tol,-30,30ppm-TC

04023J1R0ABWTR

Manufacturer Part Number
04023J1R0ABWTR
Description
Capacitor,Silicon,1pF,25VDC,.05-pF Tol,.05+pf Tol,-30,30ppm-TC
Manufacturer
AVX Corporation
Series
Accu-P®r
Datasheet

Specifications of 04023J1R0ABWTR

Capacitance
1.0pF
Voltage - Rated
25V
Tolerance
±0.05pF
Mounting Type
Surface Mount
Package / Case
0402 (1005 Metric)
Height
0.020" (0.50mm)
Operating Temperature
-55°C ~ 125°C
Features
RF, High Q, Low Loss
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
478-2762-2
Accu-F
Performance Characteristics RF Power Applications
RF POWER APPLICATIONS
In RF power applications capacitor losses generate heat. Two
factors of particular importance to designers are:
CAPACITOR HEATING
THERMAL IMPEDANCE
Thermal impedance of Accu-P
pared with the thermal impedance of Microwave MLC’s.
ADVANTAGES OF ACCU-P
IN RF POWER CIRCUITS
The optimized design of Accu-P
power circuits the following advantages:
• Minimizing the generation of heat.
• Dissipating heat as efficiently as possible.
• The major source of heat generation in a capacitor in RF
• Accu-P
• Reduced power losses due to the inherently low ESR of
• Increased power dissipation due to the high thermal
• THE ONLY TRUE TEST OF A CAPACITOR IN ANY PARTICULAR
8
6
4
2
0
APPLICATION IS ITS PERFORMANCE UNDER OPERATING
CONDITIONS IN THE ACTUAL CIRCUIT.
power applications is a function of RF current (I) and ESR,
from the relationship:
Accu-P
conductivity of Accu-P
0
Amps
200
Power dissipation = I
®
®
CAPACITOR TYPE
.
Microwave MLC
capacitors are specially designed to minimize
Microwave MLC
400
PRODUCT
Accu-P
Accu-P
Power Handling
Accu-P
®
600 800 1000 1200 1400MHz
/ Accu-P
®
®
®
.
®
2
10pF
RMS
®
chips is shown below com-
®
x ESR
offers the designer of RF
®
1210
1210
0805
0603
0402
0805
®
Magnesium Titanate
Data used in calculating the graph:
Thermal impedance of capacitors:
Thermal impedance measured using RF generator,
amplifier and strip-line transformer.
ESR of capacitors measured on Boonton 34A
MATERIAL
CHIP SIZE
Alumina
0805
1210
0505
1210
0402
0603
0805
1210
HEAT DISSIPATION
The thermal impedance expresses the temperature difference
in °C between chip center and termination caused by
a power dissipation of 1 watt in the chip. It is expressed in
°C/W.
PRACTICAL APPLICATION
IN RF POWER CIRCUITS
• Heat is dissipated from a capacitor through a variety of
• The higher the thermal conductivity of the capacitor, the
• The table below illustrates the importance of thermal
• There is a wide variety of different experimental methods
• Similarly, there is a very wide range of different circuit appli-
ESR and therefore RF heating. Values of ESR for
Accu-P
ceramic MLC components currently available.
paths, but the key factor in the removal of heat is the
thermal conductivity of the capacitor material.
more rapidly heat will be dissipated.
conductivity to the performance of Accu-P
applications.
for measuring the power handling performance of a
capacitor in RF power circuits. Each method has its
own problems and few of them exactly reproduce the
conditions present in “real” circuit applications.
cations, all with their unique characteristics and operating
conditions which cannot possibly be covered by such
“theoretical” testing.
17°C/W
12°C/W
6.5°C/W
5°C/W
®
capacitors are significantly less than those of
THERMAL CONDUCTIVITY W/mK
THERMAL IMPEDANCE (°C/W)
18.9
6.0
6.5
7.5
12
5
®
in power
21
1

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