CMF-SDP10-2 Bourns Inc., CMF-SDP10-2 Datasheet - Page 2

• Manufacturer Part Number: CMF-SDP10-2
• Description: Ceramic PTC
• Manufacturer: Bourns Inc.
• Series: CMF-SDPr

Specifications of CMF-SDP10-2

• Voltage - Max: 230V
• Current - Max: 1A
• Current - Hold (ih) (max): 180mA
• Current - Trip (it): 360mA
• Time To Trip: 3.8s
• Package / Case: Non-Standard SMD
• Lead Free Status / RoHS Status: Lead free by exemption / RoHS Compliant
• R Min/max: -
• Lead Free Status / RoHS Status: Lead free by exemption / RoHS Compliant

Packaging options: TAPE & REEL: 350 pcs. per reel
CMF-SDP07, 10, 25, 35, 50 & 75
Product Dimensions
Recommended Pad Layout
Solder Reflow Recommendations
300
250
200
150
100
50
0
CMF-SDP Series - Telecom CPTC Resettable Fuses
(.394)
(.354)
10.0
9.0
MAX.
Preheating
160–220
(.453)
MAX.
(.126)
11.5
3.2
Time (seconds)
(.102)
2.6
Soldering
10–20
(.354)
9.0
(.079)
2.0
(.197)
(.433)
5.0
(.197)
11.0
DIMENSIONS =
5.0
(.102)
2.6
(.299)
MAX.
7.6
Cooling
(.433)
120
11.0
(INCHES)
MM
Solder reflow
• Recommended reflow methods: IR, vapor phase oven, hot air oven.
• Devices are not designed to be wave soldered to the bottom side of the
• Gluing the devices is not recommended.
• Recommended maximum paste thickness is 0.25 mm (.010 inch).
• Devices can be cleaned using standard industry methods and solvents.
Note:
• If reflow temperatures exceed the recommended profile, devices may not
Rework
• A device should not be reworked.
Recommended Pad Layout
Packaging options: TAPE & REEL: 400 pcs. per reel
CMF-SDP10A, 25A, 35A & 50A
board.
meet the performance specifications.
Customers should verify actual device performance in their specific applications.
(.344)
MAX.
8.75
(.344) MAX.
8.75
(.154)
(.094)
3.9
2.4
(.323)
8.2
(.126)
Specifications are subject to change without notice.
3.2
2 PLCS.
(.020)
0.5
(.283)
(.283)
MAX.
CMF-SDP SERIES, REV. C, 11/08
7.2
7.2
(.079)
2.0
MAX.
(.154)
(.094)
3.9
2.4
(.248)
6.3
(402)
10.2
MAX.