GRM21BR71H104KA01L Murata, GRM21BR71H104KA01L Datasheet - Page 140

• Manufacturer Part Number: GRM21BR71H104KA01L
• Description: CAPACITOR, 0805 100NF 50V CAPACITOR, 0805 100NF 50V
• Manufacturer: Murata
• Series: GRM21r

Specifications of GRM21BR71H104KA01L

• Tolerance (+ Or -): 10%
• Voltage: 50VDC
• Temp Coeff (dielectric): X7R
• Operating Temp Range: -55C to 125C
• Mounting Style: Surface Mount
• Construction: SMT Chip
• Case Style: Ceramic Chip
• Failure Rate: Not Required
• Wire Form: Not Required
• Product Length (mm): 2mm
• Product Depth (mm): 1.25mm
• Product Height (mm): 1.25mm
• Product Diameter (mm): Not Requiredmm
• Capacitance: .1uF
• Package / Case: 0805
• Voltage Rating, Dc: 50V
• Capacitor Dielectric Type: CERAMIC MULTI-LAYER
• Tolerance,: 10%
• Tolerance, -: 10%
• Temp, Op. Max: 125(DEGREE C)
• Temp,: ROHS COMPLIANT
• Lead Free Status / RoHS Status: Compliant

!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
4-1. Reflow Soldering
1. When sudden heat is applied to the components, the
2. Solderability of Tin plating termination chips might be
3. When components are immersed in solvent after mounting,
Table 1
Recommended Conditions
4. Optimum Solder Amount for Reflow Soldering
138
Peak Temperature
!Caution
!Caution
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both the components and the PCB board.
Preheating conditions are shown in table 1. It is required to
keep the temperature differential between the solder and
the component's surface ( T) as small as possible.
deteriorated when a low temperature soldering profile
where the peak solder temperature is below the melting
point of Tin is used. Please confirm the Solderability of Tin
plated termination chips before use.
be sure to maintain the temperature difference ( T)
between the component and the solvent within the range
shown in the table 1.
4-1. Overly thick application of solder paste results in a
4-2. Too little solder paste results in a lack of adhesive
4-3. Make sure the solder has been applied smoothly to
Inverting the PCB
Make sure not to impose any abnormal mechanical shocks
to the PCB.
Atmosphere
Continued from the preceding page.
GRM02/03/15/18/21/31
GJM03/15
LLL15/18/21/31
LLR18
GQM18/21
GRM32/43/55
LLA18/21/31
LLM21/31
GNM
GQM22
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
excessive solder fillet height.
This makes the chip more susceptible to mechanical
and thermal stress on the board and may cause the
chips to crack.
strength on the outer electrode, which may result in
chips breaking loose from the PCB.
the end surface to a height of 0.2mm* min.
Part Number
Infrared Reflow
230 to 250 C
Air
Pb-Sn Solder
Vapor Reflow
230 to 240 C
Air
Temperature Differential
TV190 C
TV130 C
Lead Free Solder
240 to 260 C
Air or N
2
[Standard Conditions for Reflow Soldering]
[Allowable Reflow Soldering Temperature and Time]
Peak Temperature
Peak Temperature
Temperature (D)
Temperature (D)
In a case of repeated soldering, the accumulated
soldering time must be within the range shown above.
280
270
260
250
240
230
220




































200 C
170 C
150 C
130 C
170 C
150 C
130 C
0
GRM02/03: 1/3 of Chip Thickness min.






Infrared Reflow
Vapor Reflow
T
T
30
60-120 seconds 30-60 seconds
60-120 seconds












Preheating
Preheating
60
Continued on the following page.
Soldering
20 seconds max.
Soldering
Soldering Time (sec.)
90
Gradual
Cooling
Gradual
Cooling
Time
Time
0.2mm min.
in section
120
C02E.pdf
10.12.20