GRM21BR71H104KA01L Murata, GRM21BR71H104KA01L Datasheet - Page 186

• Manufacturer Part Number: GRM21BR71H104KA01L
• Description: CAPACITOR, 0805 100NF 50V CAPACITOR, 0805 100NF 50V
• Manufacturer: Murata
• Series: GRM21r

Specifications of GRM21BR71H104KA01L

• Tolerance (+ Or -): 10%
• Voltage: 50VDC
• Temp Coeff (dielectric): X7R
• Operating Temp Range: -55C to 125C
• Mounting Style: Surface Mount
• Construction: SMT Chip
• Case Style: Ceramic Chip
• Failure Rate: Not Required
• Wire Form: Not Required
• Product Length (mm): 2mm
• Product Depth (mm): 1.25mm
• Product Height (mm): 1.25mm
• Product Diameter (mm): Not Requiredmm
• Capacitance: .1uF
• Package / Case: 0805
• Voltage Rating, Dc: 50V
• Capacitor Dielectric Type: CERAMIC MULTI-LAYER
• Tolerance,: 10%
• Tolerance, -: 10%
• Temp, Op. Max: 125(DEGREE C)
• Temp,: ROHS COMPLIANT
• Lead Free Status / RoHS Status: Compliant

!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
No.
11 Deflection
12
13
14
15
* "Room condition" Temperature: 15 to 35D, Relative humidity: 45 to 75%, Atmospheric pressure: 86 to 106kPa
Only for Camera Flash Circuit Specifications and Test Methods
Continued from the preceding page.
Solderability of
Termination
Resistance
to Soldering
Heat
Temperature
Cycle
Humidity
(Steady
State)
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Item
Appearance
Capacitance
Change
D.F.
I.R.
Dielectric
Strength
Appearance
Capacitance
Change
D.F.
I.R.
Dielectric
Strength
Appearance
Capacitance
Change
D.F.
I.R.
Dielectric
Strength
No marking defects
75% of the terminations are to be soldered evenly and continuously.
No marking defects
Within T10%
0.025 max.
CU0.01 F: More than 100M • F
CF0.01 F: More than 10,000M
In accordance with item No.4
No marking defects
Within T7.5%
0.025 max.
CU0.01 F: More than 100M • F
CF0.01 F: More than 10,000M
In accordance with item No.4
No marking defects
Within T15%
0.05 max.
CU0.01 F: More than 10M • F
CF0.01 F: More than 1,000M
In accordance with item No.4
2.0Z1.25
3.2Z1.6
LZW
(mm)
1.2
2.2
a
d
Specifications
100
b
a
c
Fig. 2
Dimension (mm)
4.0
5.0
b
4.5
t : 1.6
1.65
2.0
c
GR7 Series Specifications and Test Methods
1.0
d
Solder the capacitor to the testing jig (glass epoxy board) shown
in Fig. 2.
Then apply a force in the direction shown in Fig. 3.
The soldering should be done using the reflow method and
should be conducted with care so that the soldering is uniform
and free of defects such as heat shock.
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
rosin (JIS-K-5902) (25% rosin in weight proportion).
Immerse in solder solution for 2T0.5 sec.
Immersing speed: 25T2.5mm/s
Temp. of solder: 245T5 C Lead Free Solder (Sn-3.0Ag-0.5Cu)
Preheat the capacitor at 120 to 150D for 1 min.
Immerse the capacitor in solder solution at 260T5D for 10T1
sec. Let sit at room condition* for 24T2 hrs., then measure.
#Immersing speed: 25T2.5mm/s
#Pretreatment
Fix the capacitor to the supporting jig (glass epoxy board) shown
in Fig. 4.
Perform the 5 cycles according to the 4 heat treatments listed in
the following table.
Let sit for 24T2 hrs. at room condition,* then measure.
#Pretreatment
Let the capacitor sit at 40T2D and relative humidity of 90 to 95%
for 500
Remove and let sit for 24T2 hrs. at room condition,* then
measure.
#Pretreatment
Perform a heat treatment at 150
let sit for 24T2 hrs. at room condition.*
Perform a heat treatment at 150
let sit for 24T2 hrs. at room condition.*
Perform a heat treatment at 150
let sit for 24T2 hrs. at room condition.*
Step
W24
Y
1
2
3
4
0
hrs.
Max. Operating Temp.T2
Min. Operating Temp.T3
235T5 C H60A or H63A Eutectic Solder
Glass Epoxy Board
Temperature (D)
R230
Capacitance meter
Room Temp.
Room Temp.
45
Fig. 3
Fig. 4
Test Method
20 50
45
Continued on the following page.
Pressurize
Pressurizing
speed: 1.0mm/s
W
Y10
W
Y10
W
Y10
0
0
0
Flexure=1
D for 60T5 min. and then
D for 60T5 min. and then
D for 60T5 min. and then
Solder resist
Cu
(in mm)
Time (min.)
30T3
2 to 3
30T3
2 to 3
185
C02E.pdf
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