W3L1YC105MAT1A AVX Corporation, W3L1YC105MAT1A Datasheet

Multilayer Ceramic Capacitors (MLCC) - SMD/SMT 16volt X7R 1.0uF 0612 ESL=60pF

W3L1YC105MAT1A

Manufacturer Part Number
W3L1YC105MAT1A
Description
Multilayer Ceramic Capacitors (MLCC) - SMD/SMT 16volt X7R 1.0uF 0612 ESL=60pF
Manufacturer
AVX Corporation
Type
IDC Low Inductancer
Series
W3L1r
Datasheet

Specifications of W3L1YC105MAT1A

Capacitance
1uF
Tolerance (+ Or -)
20%
Voltage
16VDC
Temp Coeff (dielectric)
X7R
Operating Temp Range
-55C to 125C
Mounting Style
Surface Mount
Package / Case
1206
Construction
SMT Chip
Lead Spacing (nom)
Not Requiredmm
Product Diameter (mm)
Not Requiredmm
Product Height (mm)
0.95mm
Product Depth (mm)
1.6mm
Product Length (mm)
3.2mm
Tolerance
20 %
Voltage Rating
16 Volts
Operating Temperature Range
- 55 C to + 125 C
Temperature Coefficient / Code
X7R
Product
Low Inductance MLCCs
Dimensions
0.063 in W x 0.126 in L x 0.95 mm H
Dissipation Factor Df
3.5
Termination Style
SMD/SMT
Lead Free Status / RoHS Status
Compliant
Low Inductance Capacitors
Introduction
The signal integrity characteristics of a Power Delivery
Network (PDN) are becoming critical aspects of board level
and semiconductor package designs due to higher operating
frequencies, larger power demands, and the ever shrinking
lower and upper voltage limits around low operating voltages.
These power system challenges are coming from mainstream
designs with operating frequencies of 300MHz or greater,
modest ICs with power demand of 15 watts or more, and
operating voltages below 3 volts.
The classic PDN topology is comprised of a series of
capacitor stages. Figure 1 is an example of this architecture
with multiple capacitor stages.
An ideal capacitor can transfer all its stored energy to a load
instantly.
instantaneous transfer of a capacitor’s stored energy. The
true nature of a capacitor can be modeled as an RLC
equivalent circuit. For most simulation purposes, it is possible
to model the characteristics of a real capacitor with one
LOW INDUCTANCE CHIP CAPACITORS
The key physical characteristic determining equivalent series
inductance (ESL) of a capacitor is the size of the current loop
it creates. The smaller the current loop, the lower the ESL. A
standard surface mount MLCC is rectangular in shape with
electrical terminations on its shorter sides. A Low Inductance
Chip Capacitor (LICC) sometimes referred to as Reverse
Geometry Capacitor (RGC) has its terminations on the longer
side of its rectangular shape.
When the distance between terminations is reduced, the size
of the current loop is reduced. Since the size of the current
loop is the primary driver of inductance, an 0306 with a
smaller current loop has significantly lower ESL then an 0603.
The reduction in ESL varies by EIA size, however, ESL is
typically reduced 60% or more with an LICC versus a
standard MLCC.
A real capacitor has parasitics that prevent
Slowest Capacitors
VR
Figure 1 Classic Power Delivery Network (PDN) Architecture
Bulk
Low Inductance Decoupling Capacitors
Board-Level
capacitor, one resistor, and one inductor. The RLC values in
this model are commonly referred to as equivalent series
capacitance (ESC), equivalent series resistance (ESR), and
equivalent series inductance (ESL).
The ESL of a capacitor determines the speed of energy
transfer to a load. The lower the ESL of a capacitor, the faster
that energy can be transferred to a load. Historically, there
has been a tradeoff between energy storage (capacitance)
and inductance (speed of energy delivery). Low ESL devices
typically have low capacitance. Likewise, higher capacitance
devices typically have higher ESLs. This tradeoff between
ESL (speed of energy delivery) and capacitance (energy
storage) drives the PDN design topology that places the
fastest low ESL capacitors as close to the load as possible.
Low Inductance MLCCs are found on semiconductor
packages and on boards as close as possible to the load.
INTERDIGITATED CAPACITORS
The size of a current loop has the greatest impact on the ESL
characteristics of a surface mount capacitor. There is a
secondary method for decreasing the ESL of a capacitor.
This secondary method uses adjacent opposing current
loops to reduce ESL. The InterDigitated Capacitor (IDC)
utilizes both primary and secondary methods of reducing
inductance.
between terminations to minimize the current loop size, then
further reduces inductance by creating adjacent opposing
current loops.
An IDC is one single capacitor with an internal structure that
has been optimized for low ESL. Similar to standard MLCC
versus LICCs, the reduction in ESL varies by EIA case size.
Typically, for the same EIA size, an IDC delivers an ESL that
is at least 80% lower than an MLCC.
Package-Level
Semiconductor Product
The IDC architecture shrinks the distance
Die-Level
Fastest Capacitors
59

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W3L1YC105MAT1A Summary of contents

Page 1

... ESLs. This tradeoff between ESL (speed of energy delivery) and capacitance (energy storage) drives the PDN design topology that places the fastest low ESL capacitors as close to the load as possible. Low Inductance MLCCs are found on semiconductor packages and on boards as close as possible to the load. ...

Page 2

... Low Inductance Capacitors Introduction LAND GRID ARRAY (LGA) CAPACITORS Land Grid Array (LGA) capacitors are based on the first Low ESL MLCC technology created to specifically address the design needs of current day Power Delivery Networks (PDNs). This is the 3rd low inductance capacitor technology developed by AVX ...

Page 3

... IDC devices are used on both ceramic and organic package substrates. These low ESL surface mount capacitors can be placed on the bottom side or the top side of a package substrate. The low profile 0.55mm maximum height IDCs can easily be used on the bottom side of BGA packages or on the die side of packages under a heat spreader ...

Page 4

... IDC Low Inductance Capacitors (RoHS) 0612/0508 IDC (InterDigitated Capacitors) SIZE Thin 0508 mm 2.03 ± 0.20 Length (in.) (0.080 ± 0.008) mm 1.27 ± 0.20 Width (in.) (0.050 ± 0.008) Terminal mm 0.50 ± 0.05 Pitch (in.) (0.020 ± 0.002) mm 0.55 MAX. Thickness (in.) (0.022) MAX. WVDC 4 6.3 ...

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